Electronics Forum: spacings (Page 8 of 119)

Via spacing

Electronics Forum | Wed Dec 04 03:20:50 EST 2019 | sssamw

You can refer to IPC or other international design standard for distance between Via holes.

Self Tensioning Frames

Electronics Forum | Wed Jan 29 10:01:24 EST 2020 | dontfeedphils

Oh yea, space savers. I switched from those to VG lol. Still prefer VG.

vacuum reflow

Electronics Forum | Thu Apr 22 14:45:19 EDT 2021 | nhusa

The SMTA Space Coast /Atlanta presentation will have a bit more information.

My HP Printer Is Printing Red, What To Do?

Electronics Forum | Tue Jul 13 14:36:48 EDT 2021 | cyber_wolf

watch the printer scene in the movie "Office Space" That is the most effective method IMO.

Stencils with two PCB layouts

Electronics Forum | Thu Feb 01 20:25:22 EST 2024 | jdengler

We do this often on smaller boards. More than saving money it reduces the storage space.

Last Chance To See Mir

Electronics Forum | Tue Jan 16 09:26:25 EST 2001 | blnorman

Got this off newsblip this morning. The Associated Press MOSCOW (January 16, 2001 7:06 a.m. EST http://www.nandotimes.com) - The Russian government has tentatively scheduled the destruction of the Mir space station in a controlled collision with E

new site

Electronics Forum | Mon Jan 15 11:07:33 EST 2001 | davef

The new format doesn't bother me. It seems less cluttered. The adverts do seem huge, but the old forum always had that white space on the right side. Maybe we gave up that white space to get bigger ads. It does seem faster. I wish they had retai

Question on BGA Solderability

Electronics Forum | Tue Jul 24 13:15:22 EDT 2001 | Steve Schrader

Greg, The increased space and hence potentially increased airflow will have no effect on "solderability." It may effect the temperature that the balls see and that is a different issue that can be worked from a profile standpoint if you are not hit

Minimum space recommended for thru-hole, pad to pad

Electronics Forum | Wed Jun 23 15:49:30 EDT 1999 | Kelly Morris

In the IPC-SM-782 (Surface Mount Design and Land Pattern Standard) it recommends a minimum of .040" between bottomside wavesoldered chip pads. Where might I find a similar IPC recommendation for minimum space between thru-hole pads? Does anyone kno

Tombstoning

Electronics Forum | Wed Jun 12 10:42:06 EDT 2002 | stepheno

Check your land patterns. I believe someone once made a typo on specs for land pattern spacing and the specs are still being used by some people. I worked for a CM that had a customer that spaced the pads for 0402's too far apart. It was the only


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