Electronics Forum: state and esd (Page 8 of 16)

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Mon Jul 16 15:44:27 EDT 2007 | davef

J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only that you verify the effectiveness of what you have in place. ESD S20.20 [1999] only says that relative humidity above 30% is "desirable". ESD S20.20 [200

bone growth stimulation system and ESD

Electronics Forum | Tue Oct 24 14:58:08 EDT 2006 | ehess

the guy has a borken collarbone, and this "promotes healing by inducing a weak electrical current at the fracture site." The distributor says it's ok. I kind of wonder if it really is.

bone growth stimulation system and ESD

Electronics Forum | Tue Oct 24 16:30:18 EDT 2006 | jax

Without getting into an electrical field promoting bone growth... As long as he is grounded through heal straps and/or wrist straps, it should be fine. Although I imagine being grounded would neutralize the "Bone Grower"

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Wed Jul 11 14:44:21 EDT 2007 | fredericksr

Hi folks! Has anyone ever successfully verified adequate ESD control at

Jammed Boards and Conveyor Rail Wear

Electronics Forum | Thu Jun 19 13:29:18 EDT 2008 | gregp

Hi Steven, Those types of substrates generally require special conveyoring for the reasons you stated. The best material would be hardened steel although you might be able to use hardcoated aluminum. The process is similar to anodizing but the fini

floor and air conditioning, shop floor requirements

Electronics Forum | Mon May 06 05:32:39 EDT 2013 | pavel_murtishev

Jim, Thank you for the input. Could you please check your standard filter pore size? A model number would be valuable. How many shop volumes (in cubic meters) do you pump per hour? Customer is seriously thinking over installing AC system similar to

floor and air conditioning, shop floor requirements

Electronics Forum | Mon May 06 21:40:40 EDT 2013 | davef

ANSI/J-STD-001: * Temperature and Humidity: 18-30°C, 30-70%RH ** If out of range, shall verify electrostatic discharge control program according to ANSI/ESD S20-20 is adequate. ** For process control, more restrictive temperature and humidity limits

optimun height between lead and pad?

Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef

Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo

Use and Restrictions of solder containing lead

Electronics Forum | Fri Jun 06 07:34:43 EDT 2003 | johnw

Rick, my understanding is that the US do not have plan's fr lead free legislation. However the European legislation states that any product entering the european market after June 2006 must meet the lead free std's of the directive. So basically if

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris

Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to


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