Electronics Forum | Tue Aug 25 06:11:13 EDT 2009 | ghepo
Eric, use the TM 650 test method annexed. Don't forget to perform many test on many PCB (TOP and BOTTOM)on PADs in several position (at 4 corners and at the center) and obviously in the faulty position. Don't forget to change every time the tape. V
Electronics Forum | Tue Feb 01 12:00:01 EST 2000 | K. Ckak
Hi Folks, I am looking for some info. and possibly a source on measuring inprocess copper plating thickness for Flex PCB manufacturing facilities. I have tried XRF, E-Current method but the supplier told us that it wont work with Flex material - th
Electronics Forum | Wed Oct 16 13:16:11 EDT 2002 | davef
Hey Mar, Sounds serious!!! Poke around Buehler, Leco, or Struers Try IPC TM-650 Test Methods Manual: 2.3.6A Etching, Ammonium Persulfate Method - 7/75 2.3.7A Etching, Ferric Chloride Method - 7/75 2.3.7.1A Cupric Chloride Etching Method - 12/94
Electronics Forum | Fri Mar 23 10:57:09 EST 2001 | blnorman
Go to http://www.ipc.org/html/fsresources.htm, scroll down and click on downloadable resources and IPC-65-650 is there for the downloading, free. The problem is that you have to download each individual test method, you can't download the entire doc
Electronics Forum | Mon Oct 06 15:48:21 EDT 2003 | Adam
Please help, we have by mistake repaired some boards using the wrong flux (water soluble on a no clean board). Unfortunatly we found out later on while we are testing the boards. The lab anyalysis clearly showed that the flux has eaten through the
Electronics Forum | Mon Mar 21 08:46:05 EST 2005 | GS
Hello Gents, Many thanks Davef for your always helpful informations. I have a question, pls, related to : which kind of Test Method are they going to be used to perform analysis (Rohs Compliance verification tests) on EEE in order to find out oncen
Electronics Forum | Mon Nov 27 15:51:51 EST 2006 | barryg
HI THERE GUYS ,GALS, DOES ANYONE KNOW OF A SPEC OR TEST OF THE AFFECTS OF HIGH VOLTAGE (300-1KV)ACROSS CONNECTIONS SOLDERED WITH NO-CLEAN. COULD THE FLUX BREAKDOWN AND CAUSE A CURRENT PATH? I HAVE CHECKED THE SPECS ON OUR SOLDER AND THE TEST METHODS
Electronics Forum | Sat Sep 29 22:56:13 EDT 2007 | asoelu
the vary results might be from following issues.. the co2 during the test the during time for this testing... the manual testing method is conductivity measurement however the bulk contamination tester like omega is resistance measurement (i remem
Electronics Forum | Thu Feb 24 22:32:56 EST 2011 | rstadem
PKannan, Your opinion is contrary to J-STD-005 "Requirements for Soldering Paste". Within that document is included specific requirements for re-certification of expired solder paste. Paste that is expired can be used after a simple viscosity test an
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
