Electronics Forum | Fri May 15 16:02:40 EDT 1998 | John S
If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular compon
Electronics Forum | Wed Nov 21 04:46:27 EST 2001 | emmanuel
Yes, i confirm you that the BGA i'm refering to are Motorola BGA. The fractures that appear after 500 thermal cycles (-45�C/+125�C) are located in the solder joint/pad connection. We have been asked if this fractures are due to BGA & PCB design or to
Electronics Forum | Mon Nov 25 15:55:32 EST 2002 | davef
Sorry, no tricks for you. The good news is: your reflow recipe should be similar for both imm tin and HASL. Imm tin requires more attention to detail by both the fabricator and the assembler than HASL. There is a fair amount of discussion on imm
Electronics Forum | Tue Feb 25 20:10:33 EST 2003 | davef
First, there is no standard. Next, on one hand, most BGA cost a lot of money. On the other hand, choosing to use reballed BGA in products for shipment depends on how well you expect to meet your customers' expectations about product reliability wit
Electronics Forum | Fri Nov 04 11:18:34 EST 2005 | patrickbruneel
I agree with Dave 100%, ATC will expose the board and components weaknesses and potential design problems and/or the need for conformal coating. The life span can only be predicted and/or extended by well-documented field failure analyses history and
Electronics Forum | Fri May 12 12:07:10 EDT 2006 | solderiron
The kester better known as KY'd Sn/Cu has more copper intermetallic growth over time, dissolves copper from the board faster so repairing and touchup can damage board. Bridges more than SN100c. Does not thermal cycle well. Has shrink cracks that can
Electronics Forum | Thu Jul 06 15:55:19 EDT 2006 | Vad
guys pls. comment which is better based on actual experience and not on the selling side of it..thanks a lot..people... one of my supplier said SACX is better but I need proof...living....he claim belo: 1. Better hole fill 2. Higher wetting force 3
Electronics Forum | Mon Aug 13 12:03:50 EDT 2007 | davef
Test results indicated that the life of lead-free solder at a 2512 chip resistor could be worse than of SnPb solder in the accelerated thermal cycling condition. [Development of Life Prediction Model for Lead-free Solder at Chip Resistor, Changwoon H
Electronics Forum | Thu May 01 09:09:31 EDT 2008 | scottp
I looked at some no flow underfills about 5 years ago and they weren't quite ready for prime time yet. It's time to give it another look and I'm wondering if anyone is using them in production and how it's working. I'm looking at them for reducing
Electronics Forum | Fri Sep 12 08:01:55 EDT 2008 | davef
There is no standard. On the web, you can find shelf life estimates for various types of solderability protection on bare boards. These estimates won't translate directly to the storage of assembled boards, because assembled boards [and the solderabi
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