Electronics Forum: thermal pad (Page 8 of 49)

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Fri Jul 21 07:01:33 EDT 2017 | emeto

Reflow oven profile and X-ray should give you all the answers that you need. Thermocouples should be attached to this ground plane.

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 16 16:24:20 EDT 2018 | slthomas

Amazingly enough, every one of these held fast where we placed them with a paste brick sized 1:1 with the thermal pad, no sectioning. Yes, there were voids, but we can live with that in this application.

Vacuum Reflow Oven

Electronics Forum | Sun May 06 21:06:59 EDT 2018 | jimpat

Thanks for the feedback. I was looking into solder pastes and saw some advertised specifically for low voiding by Indium and another supplier. This is customer driven - requesting voids in the single digit percent for components with thermal pad

IC Solder Voiding

Electronics Forum | Tue Nov 26 09:07:16 EST 2019 | scotceltic

I am more worried about those voids also instead of the voids in the thermal pads. I still can't find any IPC spec that calls out a min. void percentage other than on BGA packages.

Thermal Pads Soldering Worry, can anybody help?

Electronics Forum | Tue Jul 25 07:37:21 EDT 2017 | stephendo

There are lots of examples of changing a parameter in one direction to fix one issue causes a different problem. Once I asked a layout engineer to adjust thermal relief for through hole parts. First he said ok but a day later he said that he couldn't

Thermal Relief Pad causes bad solder

Electronics Forum | Fri Sep 09 05:32:11 EDT 2016 | jasltd

Are your solder relief pads connected to anything in terms of ground planes that would increase the thermal load or are they floating copper? I take it your talking about wave solder relief pads?

IC Solder Voiding

Electronics Forum | Wed Dec 11 07:05:28 EST 2019 | ameenullakhan

Hi, Below may help you out. per IPC 7093 ( Design and assembly Process Implementation for Bottom Termination Components ),Clause 6.1.5.3 voids on thermal pad up to 50% does not result in loss of thermal performance. Since the void criteria is

Nordic aQFN73 stencil design

Electronics Forum | Tue Apr 10 08:37:36 EDT 2018 | davef

Hi Steve ... I found nothing in the manufacturers "paper" to help. Comments are: * I agree. No blobs. Solder on the thermal pad should me minimized. Too much solder will float the component. Old timers used to talk about 50-80% coverage. * If you'

Thermally Conductive Epoxy

Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen

We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i

SMD Via hole design-thermal performance

Electronics Forum | Wed Jul 15 18:04:43 EDT 2015 | mikekeens

If it is important to have vias within thermal pads to help dissipate heat i would recommend using solder mask to stop the solder from wicking down the holes and resulting in insufficient solder. Some further info can be found here:- http://www.surf


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