Industry News | 2011-08-22 20:19:21.0
KIC announces an opportunity to win an Apple iPad2 by beating its award-winning Auto-Prediction Navigator Profiling Software. All participants will receive a certificate for a free KIC Navigator or Auto-Focus Power upgrade, a $975 value*!
Industry News | 2020-12-18 11:36:37.0
New SiZF300DT 30V MOSFET Half-Bridge Power Stage with Integrated Schottky Diode Delivers 11% Higher Output Current than Other Solutions
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2006-02-24 16:25:58.0
New MOSFET+Drivers Provide Operation up to 1 MHz and 3 % Better Efficiency Than Discrete Solutions
Industry News | 2010-03-24 13:42:48.0
San Diego - March 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will share the latest science and products for reliable nondestructive methods of profiling in booth #1549 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.
Industry News | 2019-11-05 22:24:42.0
Designing a PCB for automatic assembly and full production runs requires a few design changes from an initial prototype PCB run. Today most PCBs are assembled and tested with automated machines from the data from PCB drawing files. With up to 80% of a new product's cost determined by the first prototype build, avoiding late changes and designing with manufacturing in mind can have a significant impact on the product cost, reliability, and yield of a PCB design. Luckily, if some good choices are made early in the design process, designing a PCB for manufacturing is relatively straight forward with few pitfalls.
Industry News | 2010-09-08 11:49:17.0
PCB Fabricator Installs MASS VHF 300 VS for Via Hole Filling Addressing the continuous demands pertaining to via hole filling, through holes and blind vias
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2014-08-05 17:29:07.0
Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
