Electronics Forum: thickness increase at reflow (Page 8 of 9)

Re: Help... Need new or used SOIC-16 metal tubes - Do You Really??

Electronics Forum | Tue May 05 15:45:37 EDT 1998 | Dave F

| Looking to buy used or new tubes, that will fit an SOIC-16 | Need these tubes ASAP. We need to bake these parts and drypack. | Please email or call if you can help. | Eric Jenkins | 801 956-0897 Eric I'm not sure of the manufacturer of the parts th

Re: Oven Temperature for Solder Reflow

Electronics Forum | Sun Aug 08 20:59:55 EDT 1999 | Dreamsniper

| | | What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | | | | Profiling - tedious but important. As said, start with the paste manufacturers recomendation which is usua

Humidity of SMT component storage environment.

Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette

This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha

Tombstone

Electronics Forum | Tue Aug 28 13:08:28 EDT 2001 | seand

Hello Everyone, Mountains and mountains of data in the archives. As a contractor the variables in your production lots don't help I'm sure. On a larger scale, one suggestion maybe to first look at when and where your tomb stoning is occuring. 1

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette

Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i

QFP Shifting / Solderability Issue

Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika

These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,

Screen Printer

Electronics Forum | Tue Aug 02 15:05:38 EDT 2011 | davef

A couple of points: * Just a nit, 'screens' fell in disuse 10-15 years ago. Old habits die slowly don't they? * Yes, DEK and MPM each hold about 50% of the solder paste printer market and about 4 or 5 others hold the rest. SOLDER PASTE PRINTER EQUI

Re: Gold Immersion - Soft Joints

Electronics Forum | Tue Oct 26 13:53:16 EDT 1999 | Dave F

William: In answer to your questions: 1 "What do I do about a gold porosity problem?" Get it fixed, before you go out of business!!! You�ve been yapping about it on the internet for three days now!!! Get a more on!!! I don�t understand your com

OSP vs HASL

Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef

Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho

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