Electronics Forum | Thu Apr 11 04:03:28 EDT 2002 | mwoodall
The Alpha metals Hi Check 500 is used to measure paste deposit thickness. The paste height is found from a micrometer reading determined by focussing a beam of light on a track adjacent to a paste deposit and then onto the solder paste. I've measure
Electronics Forum | Mon Apr 13 23:02:52 EDT 2009 | davef
Use IPC-4552 for your ENIG thickness. Typically, ENIG has nickel deposit with medium [7-9 percent by weight] phosphorus content. That's what fabs do on rigid boards. On a flex with medium-P and IPC-4552 specified ENIG, you could see brittleness and
Electronics Forum | Thu Oct 06 10:57:52 EDT 2005 | SuMoTe
Put a known thickness gage next to your boards to be coated. Then coat it in the same pass as your boards. Measure the "new" thickness of your gage and subtract the difference. That will be your coating thickness. This is assuming your coating your o
Electronics Forum | Fri Mar 19 16:21:26 EST 2004 | davem
Steve is right, Cyberoptics and ASC are the 2 main players in this market. I've used machines produced by both manufacturers and they both do a pretty good jod provided the operators know what they're doing. The LSM and LSM2 are solid but aging mac
Electronics Forum | Wed Apr 10 22:35:59 EDT 2002 | davef
How do you assure you "have squeegee pressure and speed controlled"? Search the fine SMTnet Archives for background on measuring paste thickness.
Electronics Forum | Wed Aug 24 04:07:31 EDT 2005 | Khoo Meng Tze, Freescale Malaysia
Hi, I am doing a research on the solder ball joint strength of lead free PBGA package. Coming across a dozen of literatures and journals(and the industry itself), I have found out that the method of measuring intermetallic compound(IMC) formation is
Electronics Forum | Tue Aug 07 12:18:37 EDT 2001 | delnosa
Looking at ideas for "best in class" process controls for SMT mfg. ops. Wanting to add improved p-controls at some of our suppliers and I'm looking at what others may or may not recommend. Already looking at the following: Solder Printing X-Y-Z axis
Electronics Forum | Fri Apr 20 11:05:23 EDT 2001 | gcs
Just a bullet! My results are, .005" stencil thickness should measure between .0055" - .006" if your pressure is correct, metal blades and snap-off is set up correctly. Do you have aperture reductions at the QFP locations "typicial industry standard
Electronics Forum | Tue Oct 09 20:27:13 EDT 2001 | davef
That�s a 672 BALL BGA, bud!!! It�s a BIG Mutha!!! [I know. I know. For some reason suppliers call balls "pins".] Let�s focus on: * Clarifying the units on your PCB and aluminum plate thickness measurements. * Describing your use of the aluminum pl
Electronics Forum | Sat Nov 08 09:10:16 EST 2008 | davef
SN100 was designed for selective soldering and producing low levels of voiding. But thin barrel plating is a common cause of voids in wave and selective soldered connections, as you say. As a result, you checked the plating thickness and it was accep
