Electronics Forum | Wed Jul 06 14:20:18 EDT 2016 | lukvel
Dear Tom, Thanks a lot for your reply. That is exactly what I had in mind and I think that it is the best solution. Another solution is to increase the humidity in the area where the compressed air is being applied. But do you think there are othe
Electronics Forum | Fri Aug 02 09:55:41 EDT 2019 | davef
While I agree there is "too much solder" on this board, I don't think that is the sole explanation of what's going on here. I don't think the pads on the board match up well with the terminations on the components.
Electronics Forum | Tue Nov 26 09:05:48 EST 2019 | scotceltic
Thank you for the response. Nothing in the datasheet referring to a percentage of thermal pad coverage. I am thinking along the same lines. We are not failing any thermal or functional testing as is so am thinking there is no problem here except m
Electronics Forum | Thu Jul 16 05:42:48 EDT 2020 | mcbasol
Dear Rau, I think, it is not important to buy the machines. Technical and maintance support is more more important. Thank you for reply. But, we do not think to buy machines which is not support services in Turkey. Best Regards.
Electronics Forum | Thu Dec 17 16:02:41 EST 2020 | proceng1
I think over printing is the best option, and I like the idea of ordering a test stencil with increasing sized apertures. Make sure you go beyond what you think will work, just so you know where line is.
Electronics Forum | Tue Apr 02 19:59:36 EDT 2024 | lremme
I think it's FAT16, but not sure. Yes, it was cloned on a modern computer, but it was bit for bit so should be identical. I didn't think you had to format it before cloning.
Electronics Forum | Sat Mar 08 21:31:17 EST 2003 | MA/NY DDave
Hi Yes DavidF I agree, and that is what I think I am reading in the orginal and follow on post from the poster. I think this problem is just below full failure to solder which was your point, I think. You, and I particularly, are taking opposing y
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Wed Mar 01 17:05:34 EST 2000 | Dave F
Glenn: I hear you, but when Steve talks about a "dark haze" and "scrap(ing) the �black stuff� off the pads" to make them solderable, but I don�t think of "black pad." I think of "black pad" as a surface coating that typically can not be removed by
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
