Electronics Forum | Thu Jun 06 07:53:51 EDT 2002 | Jim M.
Has anyone had much luck Picking and Placing die with a Panasonic MPA-G3?What special setups or considerations are required? Currently we pick and place one die with our Universal GSM using only one nozzle. The nozzle must be painted white in order
Electronics Forum | Mon Feb 26 10:02:27 EST 2007 | Cal
Pay Recyclers: Ecological Technologies, Inc. 1230 Oakmead Parkway, #308 Sunnyvale, California 94085 U.S.A Phone: 408.524.7100 ;Fax: 408.524.7103 http://www.eco-tech.com/index.shtml OR The SemiCycle Foundation 2111 Kramer Lane Austin, Texas 78758
Electronics Forum | Sun Jan 13 19:44:02 EST 2008 | grantp
Hi, We need to solder a USB plug onto a PCB in our SMT machines, and this is the same type of plug you see on USB storage devices. It's a very flat connector with 4 SMT pins, however the hard part is the bottom of the connectors is the same level
Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke
Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow
Electronics Forum | Wed May 20 16:07:22 EDT 2020 | stephendo
You want a big enough storage tank to smooth pressure. Figure out what size pipes you need and go a size bigger. Make a loop of the pipes with shut offs. That way you can shut down any section and still have air to the rest of the air line. Run the p
Electronics Forum | Tue Dec 05 15:10:55 EST 2000 | Francois Monette
Victor, here are a few more elements of information to answer your question. Both the temperature and relative humidity on the manufacturing floor have a significant impact relative to the rate of diffusion of moisture inside a plastic package and t
Electronics Forum | Thu Jan 21 19:38:24 EST 1999 | dean
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Thu Jan 21 20:22:02 EST 1999 | Earl Moon
| | Hello, | | | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, an
Electronics Forum | Sun Jan 10 08:44:32 EST 1999 | Dave F
| | | HI! I am a package engineer in Korea. I have some reasons | | | to desolder excessive solder at the lead of TSOP and TSOJ | | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. |
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r