Electronics Forum | Fri Jul 15 10:56:19 EDT 2005 | pr
As Russ said, you do a DOE beforehand. BUT Maybe we are missing something, we do SPC after the wave (1/5) to catch defect trends and fix them with a minimum of inspection. If you are running a 2,000 piece pull, are you that confident that your origin
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Thu Jun 01 04:51:21 EDT 2006 | EC
Hi TS, Most of the machines will face this problem after been using few years.....I handling SMT equipments ( Fuji machine ) and process.....sorry if I have offened you...... Hi Jack, Firstly, you must able to tell which component having a high thr
Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman
Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
Electronics Forum | Tue Aug 21 08:34:03 EDT 2007 | rgduval
We have the same problems with cut/tape parts. But, we specialize in short-run prototypes, so I don't have much of a choice but to deal with it, and find a way to make it as easy as possible. We just demo'd a splice tool from Sierra Electronics (ww
Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer
| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!
Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea
| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor
Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon
| From several months I am investigation about the VOIDS PERSENCE and his important as reliability. | One question now is : | It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? | I
Electronics Forum | Fri Sep 24 12:02:57 EDT 2004 | Frank
Yes, I can see your problem, the nozzle makes only good contact in the center and so the ends don't make good contact. The ends tend to curl up during reflow. There were two suggestions to solve this. 1) Let the operator push down the labels befor
