Electronics Forum | Wed Sep 30 11:57:19 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Wed Sep 30 11:56:46 EDT 1998 | Manish Ranjan
Hi Everybody Is anyone aware of the possible causes that may lead to voids in the solder bumps after assembly. We assembled some dice on thin substrates and after assembly, void formation in the solder bumps were observed. We have already trie
Electronics Forum | Fri Sep 03 06:53:38 EDT 2010 | arjan
Yes, we assembled a lot of QFN in the last years, but we don't have a X-ray machine by ourself, so we cant't inspect each device. This type LGA was designed on a prototyping board of our customer so we would validate our LGA reflow process and a rese
Electronics Forum | Thu Apr 17 13:00:28 EDT 2003 | Takfire
Russ, The caps are 0603 case size. I am not sure about the manufacturing details, as I work for the capacitor supplier. The manufacturing details are unclear at the moment, as the customer (South of the border) has not released such detailed inform
Electronics Forum | Thu Apr 17 17:38:57 EDT 2003 | Takfire
Dave, I am not exactly sure what is driving them to believe that this is a capacitor issue. It is unfortunate, that this belief has slowed their activity in further understanding their manufacturing process. The caps are BME (Base Metal Electrode
Electronics Forum | Tue Mar 09 17:52:05 EST 2004 | davef
Bryan: Comments are: * You're correct, solder paste formualtion is a major driver to voiding in BGA balls. * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on a temp
Electronics Forum | Tue Dec 23 01:23:45 EST 1997 | J.H Kim
I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.
Electronics Forum | Wed Sep 01 07:44:36 EDT 2010 | sachu_70
Dear SMT-manufacturer, I would recommend to also have other device joints on board X-ray inspected to understand if void formations are seen across the board or confined only to one component. If seen across, your "Reflow Profile" could be the cause
Electronics Forum | Fri Jan 15 15:29:03 EST 1999 | Jason Hall
| Our spec on voids is 30% ball diameter in the center. On the component to ball and pad to ball interface, we use 25%. To determine this spec, we asked around. I don't know of any studies that have been done to verify if this is OK | | Regards | Ji
Electronics Forum | Tue Mar 06 09:18:33 EST 2001 | davef
Two things: 1 Go to IPC and buy "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process - Provides direction to electronics manufacturers interested in adopting low residue (LR) assembly technology. It addresses the concern
.gif)
