Electronics Forum | Sun Sep 22 23:23:39 EDT 2019 | sssamw
Yes, no wetting on the several leads, to verify is same location of the leads? Looks PCB/IC leads wetting issue, a process contaminated or raw material issue. A cross experiments to verify the potential cause is needed.
Electronics Forum | Tue May 10 12:11:27 EDT 2011 | scottp
Do you have pictures and/or cross-sections of the non-wet? Is the HASL SnPb or SN100?
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Fri Dec 27 14:27:40 EST 2019 | slthomas
We switched to a REL0 T3 paste, Amtech LF-4300. It wets the castellations more consistently. I believe that in our case it was more of a plating wetting issue with the parts, but yours sounds more like a pcb finish or thermal issue. That larger pad
Electronics Forum | Wed Jul 28 09:15:46 EDT 2010 | vetteboy86
I took a pad that did not have any solder flow (wetting issue with pad) and not reworkable with soldering iron, and scraped with an exacto knife. After scraping the pad soldered fine. Any suggestions?
Electronics Forum | Tue Sep 01 11:30:28 EDT 2009 | rgduval
Is the solder wetting to the pad, and not to the part? If so, and all other things being true (same process, profile, solder), we'd suspect some contamination on the part preventing solder from wetting to the part. This could be tested by attemptin
Electronics Forum | Mon Dec 20 16:34:15 EST 2004 | steve
Customer has tried OA and NC alloy solder pads may be nickel Chromium. Non-wetting issue. Scraping pad alloys a bit of adhesion of solder but no intermettalic bond. Any suggestions?
Electronics Forum | Fri Mar 16 08:01:53 EDT 2007 | ck_the_flip
SAC coated leads on certain components require more dwell time. If you find that you have top-side wetting issues, slow the conveyor down a bit or increase your wave height, or, a combination of the 2.
Electronics Forum | Thu Sep 03 02:38:00 EDT 2009 | sachu_70
Does the established joint still exist if once again re-touched by a soldering iron, or does it return to the original problem? Wetting issues on pad could be for many reasons and you could analyze with a cause effect diagram.
