Electronics Forum: which and soldering and iron (Page 8 of 16)

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Kester R562 and using lead free components

Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james

We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which

Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik

I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a

Solder cream kits (flux and powder separately)

Electronics Forum | Fri Mar 03 09:05:59 EST 2000 | Istv�n Dominik

I received data sheets from a paste distributor in which Amtech gives a recipe how you can mix solder cream. They deliver the flux in plastic jars and the solderpowder in foil packages. You must mix the two components with a simple mixing tool. Has a

Use and Restrictions of solder containing lead

Electronics Forum | Thu Jun 05 06:03:49 EDT 2003 | iman

Japan and Europe are the main champions for the leadfee solder initiative. USA join in due to global political efforts as one of the cub scout leaderships. Military and Automobile industrial-electronics is exempt from the leadfree directive. Reason

silicone conformal coat and electrical contacts

Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw

I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a

OSP and getting full pad wetting??

Electronics Forum | Thu Apr 17 13:37:11 EDT 2014 | anvil1021

Hello All....we have several hundred PCBs that we need to run with a no-clean solder process and the surface finish is OSP. Our preliminary testing has found that the solder will not wet the entire pad even if the pad is over printed? We have contact

Stencil Bleed - Bridges and Solder Balls

Electronics Forum | Mon Aug 14 01:29:49 EDT 2023 | calebcsmt

I have noticed on a recent project, the QFN and SOP solder deposits do not seem very uniform and have been leaving little balls, whiskers and icicles of solder paste coming from some pads which leads to bridges. https://imgur.com/a/lqw5RF1 I have u

Conductive contamination and the elusive solution

Electronics Forum | Mon Jul 16 08:42:14 EDT 2007 | realchunks

Hi Scott, Here is another thought. Check your wave solder machine visually. Does the wave flow on both sides of the nozzle? If not, you may have some dross build-up which may be causing your problem. Generally it will only happen on the very fir

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Sat Apr 24 08:23:03 EDT 1999 | Bubba

| Surprisingly enough, ever since the addition of an omega wave, we solder those often-troublesome SOT23's just fine and dandy.. anyways, long-term, well be getting a universal GDM which uses positive displacement pumps..currently we're using fuji g


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