Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Sep 21 12:10:23 EDT 1999 | Mario
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Sat Apr 19 10:45:43 EDT 2003 | Joe
Yngwie, In a previous life, I used a mixer made by Malcolm and was very happy with it. We used Alpha 609 WS paste and experienced no separation problems. The Malcolm equipment agitated the material in a non-concentric motion which tends to "fold
Electronics Forum | Wed Apr 30 20:33:15 EDT 2003 | davef
Haaaa!!!! Yes, we�ve seen things like that. We found that a high input impedance amplifier worked fine in a room with a controlled environment and worked poorly in the sweat-shop portion of our plant. We were using good ol� WS609, straight water w
Electronics Forum | Tue Apr 13 21:33:48 EDT 2004 | qualitel
Hi Dreamsniper, It seen this is the major issue had been occurs you.( We had face all this issue last time too) We had done a lot of areospace products before and most of ours products is a must on class 3 spec. BGA is not that tough t
Electronics Forum | Thu Dec 09 17:18:44 EST 1999 | Russ
Ron, I'll bet you have the Ni/Pd finsh on these components! We have had the same problem in our shop. Not knowing the Kester spec. we had to raise the max temp to 220 Deg. C and increase the time above liquidous to 60 seconds or greater. It seem
Electronics Forum | Fri Feb 16 11:37:58 EST 2007 | hectorsmtnet
I have been using the Loctite Multicore WS200 with great results for the last two years. We also use the lead free version WS300. I like the flux chemistry (which is the same for both products); it really withstands long soaking times and with very g
Electronics Forum | Thu Oct 07 22:05:23 EDT 1999 | Dreamsniper
Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. PCB is FR4 Solder Mask is LPI Reflow and W/S Profile = Standard thanks and regards,
Electronics Forum | Thu Aug 23 00:17:53 EDT 2001 | mugen
Mike, 1) NC process = less BGA voids & void-size 2) longer soak times... Heyz, thanks mate :) ~~~~~~~~~~~~~~ Dave F, tot u were inclinded to the school of thought, that NC process hath higher chance for whining abt voids?
Electronics Forum | Thu Aug 23 01:23:03 EDT 2001 | mugen
Thanks, for pointing out my lack of, precision inquiry methodology.... I'll keep it in mind, and stay on my toes, next time I post a forum question... Regards
