Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef
Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem
Electronics Forum | Fri Apr 10 09:59:13 EDT 2020 | spoiltforchoice
> We unfortunately use GERBER data to digitize <BR> > boards more than any CAD. We are CM and many of <BR> > our customers do not provide CAD. With some <BR> > Legacy products, we still use 274-D Gerbers
Electronics Forum | Mon Jul 12 11:35:27 EDT 2004 | Pierre RICHARD
Here are some answers to my questions after a good research. I also added more definitions that could help understand this esoteric language used in assembly, specially surrounding fluxes and their use. In blue italics are comments and extracts from
Electronics Forum | Tue Apr 27 05:26:14 EDT 1999 | Charles Stringer
| | Hey MoonMan, | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | We we're all set up to go to Tetras, then mgt decided to close down our factory - Dooop!
Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea
| | | Hey MoonMan, | | | | | | Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. | | | | | | We we're all set up to go to Tetras, then mgt decided to close down our factor
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Thu Apr 13 18:28:01 EDT 2000 | Michael Parker
Hello - I am currently evaluating uBGA rework and X-Ray inspection solutions. I would like any advice/warnings etc. regarding suppliers and equipment. I have already researched through the threads in this forum and have created a list of recommended
Electronics Forum | Fri Mar 26 19:32:05 EST 1999 | Martin Dunning
I am a student doing a project on rework os BGAS and CSPS and Im looking for information on it especially rework of csps Has anyone got x-ray images of csps after rework or of BGAS to show csps with solder balls Appreciate any help Urgent!!!!
Electronics Forum | Sun Jul 14 05:37:17 EDT 2002 | johnw
Hi all bga placcement on an ip2 can is possible although as pointed out the x/y dimensionsof the part are used for placement I would suggest you arrange for your parts to be taped and reeled as this is the prefered way to go what size are the bga,s
Electronics Forum | Thu Mar 25 12:24:12 EDT 2010 | ssager
When testing components on a PCBA, try to validate coverage for presence, correct, orientation, live, and alignment. AOI is not really great at catching cold solder joints and damaged components, and from my experience an X-Ray is only as good as the
