Electronics Forum | Fri Jul 13 05:25:03 EDT 2001 | surachai
I would like to know about the efficiency of hot air knife debridging option with wave solder machine ,anyone use this option please suggestion to me about yield ,side effect or profitable of this option . Thanks.
Electronics Forum | Fri Jul 13 14:56:01 EDT 2001 | stevenamacdonald
One of our board vendors recently switched their stencil design to home plate apertures. Since the change the quality and yield of their PCB's has went south, Could this process change be the cause?
Electronics Forum | Wed Sep 08 17:23:16 EDT 1999 | Duane Nguyen
| Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | Hi Chris, Why don't you process a double side reflow and use selective wave fixture for wave process. The process will be easie
Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad
Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than
Electronics Forum | Wed Jun 19 18:29:26 EDT 2002 | surinder
Is somebody has Comparison data between SMT Glue & Solderpaste process.I know,the paste printing process is better to achieve high yields,but I want to see some Comparison data in terms of rework.
Electronics Forum | Thu Jul 18 12:37:00 EDT 2002 | slthomas
"On the average we touch up about 6 - 12% of all solder joints." Do you mean at least one joint on 6-12% of all your boards, maybe? Sorry, I can be dense....
Electronics Forum | Thu Aug 01 04:12:39 EDT 2002 | jk
Anyone have experience with BGA mount on via hole in pad. I'm encountering about 1 to 2% yield loss due to BGA solder short. This is an entek PCB. The BGA pad size is 32 mil, and the via hole (dia. 10 mil) is at the center of the pad. Any professiona
Electronics Forum | Thu Aug 29 18:32:42 EDT 2002 | Dreamsniper
Hi Steve, On my point of view, you already answered your own questions and I agree with your answer. regards, Dreamsniper
Electronics Forum | Thu Aug 29 20:00:32 EDT 2002 | iceman
Steve, I agree, you should expect to have better results from double sided reflow. It is more difficult to dial in a wave solder process for SMT components than a reflow oven. Besides that - adhesive is just no fun to work with.
Electronics Forum | Wed Sep 04 21:34:43 EDT 2002 | caldon
I guess I can figure out what the next posting will be...."My Components do not soldering" Further analysis determins....Twinkie Goo and and all of it elements are not good for hi yield production. Someone needed to add technical content.
