Electronics Forum | Mon Sep 13 22:32:41 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Electronics Forum | Mon Sep 13 22:58:49 EDT 2010 | genesan
Hi all good morning and need advice from expertise here. One of my customer complain that they have constantly issues with one of their product and ask us to do cross section.The report show there was “no wetting to the PCB copper pad” and cause the
Electronics Forum | Fri Sep 24 16:01:07 EDT 2010 | dougt
I remember this problem but can't remember exactly what the reason was. It might have been the wrong pullup resistor on the MEI interface board used for the home photo on the y axis. You are right, after a couple hours the machine would work fine.
Electronics Forum | Sat Oct 02 15:26:59 EDT 2010 | rway
Possible, but difficult. What algorithm programs are you referring to? Mirtec and YesTech both utilize algorithms in their respective software. The algorithm is simply a series of instructions to perform the inspection. In this case, rules-based,
Electronics Forum | Fri Oct 29 11:23:51 EDT 2010 | pfloh
Just for your reference. If you need to check for surface contamination, then we shall go for microscope inspection at different modes. But this will not reflect on actual PCB performance. Solderability test will still a good option if PCBA is expe
Electronics Forum | Fri Nov 05 18:47:31 EDT 2010 | eadthem
I'm guessing when you say bare board you mean wet paste only? When you say the pads move slightly are your boards warped at all at the Vscore? What we do is use per modual fids. first you delete or don't make panel fids and then theres a option wh
Electronics Forum | Sat Dec 18 08:23:33 EST 2010 | remullis
I experienced warpage on a 7'x 13" long board, unfortunately my oven does not have center support. I use stiffeners on both of the short ends. It fixed my problem. Some of the things I was experiencing with the warpage on the second pass were placem
Electronics Forum | Thu Jan 20 00:22:07 EST 2011 | yangloh
Dear Industry experts, We have just developed a leadless, fluxless solder that can join various metals ) Al, Cu, brass, Steel, stainless and Titanium) and Ceramics ( Ruby, Quartz, Sapphires, glass, TiO2, etc) We intend to explore electronics and
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Fri Apr 01 02:56:18 EDT 2011 | grahamcooper22
the cause could be moisture in your pcbs. To check it...pass some bare pcbs through your reflow oven (this is a simple way of drying them out a bit), then paste and place and reflow as normal....if solder beads disappear then the pcbs have too much m
