Electronics Forum | Tue Jun 04 13:13:58 EDT 2002 | slthomas
Another thing we see is solder balls (sometimes fines, sometimes larger stuff) in the vias after a misprint has been poorly cleaned, as in wiped down but not washed. They end up in the plated through holes too, but those get nicely cleaned up in the
Electronics Forum | Sat Jul 27 14:30:56 EDT 2002 | Juan C. Ruiz
Do you have any picture or reference how can we determine black pad or plating contamination. I have heard about a lot of problems regarding BGA's and normally these components are only replaced or heat it and that's it ,after that the boards are wor
Electronics Forum | Mon Sep 09 11:20:50 EDT 2002 | ksfacinelli
I have never seen that occur when using gold plating vs. HASL. I am a big fan of the gold process and have achieved very consistent quality. Did the board vender do an impedance measure to validate you design?
Electronics Forum | Thu Sep 19 21:17:50 EDT 2002 | Sam
We had encountered similar problem before. But the cause was found out to be the poor good plating, instead of contamination. The way we dealt with that was sending them to the supplier for rework. It may be the fastest and most relaibility way. Goo
Electronics Forum | Thu Sep 26 12:21:24 EDT 2002 | dragonslayr
What are the specs of a Formica type bench top? Gloss or mottled finish? Should the edge be straight, rolled or bull-nosed? Can I get it in ESD safe composition? Can you recommend a good calibrator of formica?
Electronics Forum | Thu Sep 26 20:26:35 EDT 2002 | davef
I got one, but you don't need one. Coy, eh? Oh, but these measurements need to be soooo precise, don't they?
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
Electronics Forum | Wed Oct 09 12:29:14 EDT 2002 | ppcbs
We have been encountering black pad contamination on gold plated boards mainly affecting BGA components during assembly. This problem has been noticed with many of our customers that are using an array of fab vendors. Does anyone have a solution fo
Electronics Forum | Sat Oct 12 06:43:49 EDT 2002 | davef
Alternatives to consider are: * Opening-up your stencil aperture put-down more paste to compensate for the amount that is being used to fill the via. * Relaying-out the board to plug and plate over the via. * Relaying-out the board to move the via fr
