Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude
We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr
Electronics Forum | Thu Sep 02 05:31:34 EDT 2004 | Simon UK
Hi All there ! I'm looking on advice on how to > get on with programming of Flextronics > HyperVision S4 test programms. The book they > provided is ending on seting up feducials, and > that's all . > > Best regards, Muad'Dim Well i can only s
Electronics Forum | Mon Jan 10 13:59:54 EST 2005 | mdemos1
Hi. I am looking for information on storing completed PCBAs in a warehouse environment. My current assemblies use standard FR4 material - 4 to 6 layers. Component types range from 0402s to fine pitch QFPs and micro-BGAs. If I were to store this i
Electronics Forum | Fri Feb 18 09:06:33 EST 2005 | russ
This is what we use. 1. we only reball when we experience a manufacturing defect (short, trapped component, etc...)and if the part is expensive 2. No testing is done prior since we only reball parts that have a defective attachment. 4. The reliabi
Electronics Forum | Wed Feb 16 09:37:58 EST 2005 | beta
Hi Guys, I have a customer who requires 95 paper 8*4 CP6 feeders on the setup. We dont have the required quantity but we do have embossed feeders that we could use. Just looking for some onfo. on performance using paper in embossed feeders as I migh
Electronics Forum | Sun Apr 10 06:27:50 EDT 2005 | WarpSpeed
1.) First of all: What is Your customers requirements??? 2.) If the customer or You don't have a specification; I will strongly recommend that you follow the "IPC-IPC-TM-650 Method 2.4.22 Bow & Twist" that [DaveF] suggested. 3.) If You have "critic
Electronics Forum | Wed May 04 10:42:55 EDT 2005 | nice90
Handling a PCB 1. Check your ESD slippers and ESD Strap first before entering the SMT production line 2. A PCB manufactred over 90 days must be stored first on the baking Oven before Production 3. Temperature on the Baking oven must be 125plus and m
Electronics Forum | Thu Jun 16 18:19:05 EDT 2005 | Jason Fullerton
If the uBGA has aperatures that are 0.25mm square, you need to use a laser cut foil no thicker than 3.75 mils to get an area ratio of 0.67, which is the minimum rule of thumb - that's too thin! Electroform would probably work up to 4.5 mils thick.
Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000
We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho
Electronics Forum | Fri Sep 16 11:58:46 EDT 2005 | vinod
Friends, I have a PCB with Immersion GOld (ENIG) finish. Here are the detalis on the PCB. 1. 6 Layers 2. Immersion Gold (ENIG)Nickel 125-250 Micro inch. 3. FR4 Material 4. Thickness 0.062". I am having problem soldering the through hole components.
