Electronics Forum | Tue Jun 08 08:27:14 EDT 2004 | michaeljm
I would like to see the report from MacDermid. We have samples of ag boards in which the underside of PCB pad has been plated between the PCB laminate and pad.
Electronics Forum | Wed Apr 28 12:32:07 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Wed Apr 28 13:37:21 EDT 2004 | mrmaint
Paul, We are applying the paste flux to the bga. We have a plate that has a 4mil step that we squeege flat and then dip the BGA into the flux.The BGA's that we are using are new components.
Electronics Forum | Mon Jun 07 22:05:58 EDT 2004 | Ken
Me too. Check out this months Circuits Assembly. Dage has an interesting article about voiding as a function of surface plating....
Electronics Forum | Mon Jun 14 22:49:46 EDT 2004 | Ken
Um...I would reject those boards. skip plating is a process indicator...a bad indicator. IF your building to class 3...I would get the rep in ASAP and reject the lot.
Electronics Forum | Tue Jun 15 08:22:39 EDT 2004 | jsmith01
The parts are dated Mar 20 2004. My profile hits a peek of around 232-240c and is above 225 for around 30 seconds.
Electronics Forum | Tue Jun 15 11:08:02 EDT 2004 | russ
Well take away the easy answers! How are the parts falling off? Is the joint breaking the termination on the part or is it breaking at the solder to termination interface? Also, how long are these parts in liquidous state? and what type of paste a
Electronics Forum | Wed Jun 16 20:36:42 EDT 2004 | russ
Well I am clueless! I have a lead free build coming up and I am going to check to see if our parts do the same thing. I will let you know. Russ
Electronics Forum | Tue Jul 27 07:18:44 EDT 2004 | Nippy
How does the HASL finish and stencil match ? I have seen ocasions on fine pitch devices where the HASL can protrude into the stencil aperture either pulling paste down on the snap off or completely blocking the aperture and getting no paste.
Electronics Forum | Wed Aug 04 16:49:24 EDT 2004 | jim_bob
Regarding Lead Free component finishes, vendors are zeroing in on matte tin plating as the finish of choice. What test are performed, to determine if a finish is "matte" type (vs. non-matte)?
