Electronics Forum | Tue Dec 22 23:21:53 EST 2020 | tueftler
I dont think so. SMT splice tape is what i'm using to fit separate smd snippets together... Isnt it?
Electronics Forum | Wed Nov 04 17:18:30 EST 2009 | davef
It will be very difficult to apply the proper amount of solder with a stencil to bump a ball that is the proper size. A low volume ball is less reliable than a customary sized ball. There are: * Reballing service providers * Reballing preforms * For
Electronics Forum | Thu Nov 05 13:00:27 EST 2009 | swag
The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-work
Electronics Forum | Wed Dec 23 13:29:09 EST 2020 | spoiltforchoice
Yeah, if the convenient non sticky tab for unpeeling is not important to you, narrow tape is another option. "Grid Tape" used for drawing lines on whiteboards is not too sticky and only 4mm wide. Most of the time the lazy option of pulling it really
Electronics Forum | Mon Mar 20 22:08:24 EDT 2023 | tey422
For reflow oven to "auto off" it has to go through the cool down; it should be off went the cool off temperature is reached. Perhaps you need to 1st check if something prevent the oven reach the cool off temp (both hardware & software).
Electronics Forum | Thu Jan 26 14:47:46 EST 2006 | james
Just wondering what others are doing as far MSD parts. We keep most of our parts in the dry cabinet before use. Most bags are openend and have passed the recomendation as far as mounting within a certain time. We have had defects with boards that
Electronics Forum | Tue Jan 20 07:57:00 EST 2009 | mrdtech
Depends on the solder paste. If it has been on the stencil for 24h there is a good chance that the paste is destroyed. You can however check if it has not dried out too much by letting the stencil printer do a few strokes and see if the paste still h
Electronics Forum | Tue Jan 20 08:38:37 EST 2009 | davef
MrDif: You don't add fresh paste to used paste? We add fresh paste to used paste on the stencil to replenish the paste consumed while printing boards, so that we maintain a nice thumb-size roll of paste. We change the used paste when we clean the ste
Electronics Forum | Thu Nov 05 13:38:43 EST 2009 | davef
Martin It might be possible to mount a deballed BGA as you mount a QFN. Thinking about doing it, it could be a lot more difficult than first thought. When you heat a BGA, it 'dances' on the board because of the different CTE of the materials involved
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
