Electronics Forum: pass (Page 83 of 142)

Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Fri Sep 11 15:11:23 EDT 1998 | Dave Celestian

I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. The problem here is t

Re: Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Mon Sep 14 09:09:10 EDT 1998 | Earl Moon

I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the composite surface is bubbling up and glass fibers are also starting to show. The problem here

Re: Wave Solder Fixtures: Biting the dust FAST!

Electronics Forum | Fri Sep 11 15:26:15 EDT 1998 | Upinder Singh

Dave, What exactly is the material used for making the fixtures? Upinder ====================== I am running composite fixtures on my wave solder machine and after about 500 passes each (1 month)they are showing serious signs of wear in that the co

Re: Thanks

Electronics Forum | Thu Oct 01 16:43:24 EDT 1998 | Mike Demos

Thanks for your reply! I do appreciate your response. I received some information from the company that sells Accuspec, but I hadn't heard from any users yet. Your sales pitch sounds on your unit sounds tempting, but I'll have to pass on your Ac

Re: Cracking Capacitors

Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson

I am in need of possible causes and solutions to capacitors that are failing in the field. Are there issues in our process that need to be checked? Some people said the problems are due to improper storage. Others say it is thermal stre

Re: Solder ball bridging under BGA

Electronics Forum | Wed Sep 02 08:44:50 EDT 1998 | Kelly Morris

Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it.

Re: Pin in hole process problem

Electronics Forum | Wed Jul 29 17:39:40 EDT 1998 | David Spilker

Hello everybody. Remember I posted some questions on the smtnet regarding placing the thru hole connector using paste and reflow(pin in hole). I have able to accomplish the process succcesfully.....but I have a problem. The boards are failing at

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 14:52:46 EDT 1998 | Mike

How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 16:20:43 EDT 1998 | Earl Moon

How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can

Re: BGA In-circuit Failure Analysis

Electronics Forum | Mon Jun 08 12:42:01 EDT 1998 | Earl Moon

How do I mechanically/visually inspect BGA devices when they are soldered to a PCB for possible solder, or other, defects as a first step before part removal and further analysis? I have had board failures due to poor soldering--I think? I can pr


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