Electronics Forum | Tue Oct 18 06:04:39 EDT 2005 | Rob
It depends on a number of factors - including as Russ pointed out, complexity (sometimes you need to create very complex profiles if you have large BGAs and other such components, which require at least 7 heated zones), then you have size, required l
Electronics Forum | Sat Nov 24 15:44:28 EST 2007 | mika
Hi DaveF, I had a short look into the Nr1. IMPACT OF MICROVIA-IN-PAD DESIGN ON VOID FORMATION Most interesting reading, but one thing though, I could not find any information about the oven profile. Just a picture of it. My question is of about the
Electronics Forum | Tue Feb 24 15:31:44 EST 2009 | pcbrookie
Wrongway - Interesting about the rails. I'll check to make sure operators are leaving a little 'wriggle room' on the rails in case they are in fact getting narrower in the middle. SWAG - I suspected the initial temp. might be a bit hot, thus causin
Electronics Forum | Tue Feb 04 09:21:48 EST 2020 | nhusa
There are two areas that are important when discussing cooling rate. One is the rate thru the liquidus, where a fast rate produces small grains in the metal and a slow rate results in larger grains. Although smaller grains are stronger normal SM
Electronics Forum | Tue Feb 22 07:19:51 EST 2005 | austinj
I have been profiling with the fixture. I have performed multiple DOE runs and came up with the following with success: Cooled soak zone to max 150C for approx 100sec. and spiked reflow zone for max temp of 230C, pcb/panel is above 183C for 64sec.
Electronics Forum | Wed May 02 04:25:50 EDT 2012 | geb
Hi, We power down our reflow oven over the weekend, but before that we let the heating zones cool to approx 100degC. Its something we've always done as we were told to do it when we bought the line. Does anyone else do this, and what would happen if
Electronics Forum | Wed Jun 05 13:21:11 EDT 2002 | Hussman69
That's OK, as long as you didn't say breading, I knew what you meant. Well, for a quick fix try placing Kapton tape over the gold. It's not a cure, but gets you product. Next try putting a couple of non-screen printed boards thru the oven and se
Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman
We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl
Electronics Forum | Thu Jul 07 04:34:19 EDT 2005 | Lloyd
This problem exists at a very low level but happens on all our discrete components, all our products and in two plants. Between the PCB land and the component termination there is a barrier of flux residue, this actually lifts the component slightly
Electronics Forum | Tue Jun 08 17:51:37 EDT 2010 | vmorina
Hi Vee, We are planing on doing low-medium volume and prototyping boards with the following packages. TQFP, BGA and other SMT packages. I would like to go with some thing like batch/tabletop oven for now, but I am not excluding conveyor reflow oven
