Electronics Forum | Wed Jun 13 12:19:25 EDT 2007 | allwave
Brian, We had similar problem in our inline wash machine time ago. We checked everythin on equipment (filters, DI water purity, sprayers angle, etc). To make the long story short, we found out that the problem was caused by a new solder paste. This s
Electronics Forum | Tue Oct 07 09:40:44 EDT 2008 | john_smith
Dear, Flexkhushi Do you mean 2 mm thick board or .2 mm board. If you are talking .2mm then you are refering to a flex circuit correct? What equipment will you be using to place the 01005 component? I
Electronics Forum | Wed Apr 29 17:51:44 EDT 2009 | smt_guy
One more thing: I have a Panelized PCB with 8 boards on the X directions. As I move to the next PCB towards the right my misalignment moves to the right by 0.02mm. By the time I reach the 8th PCB I'm Off by between 0.12mm to 0.14mm. My fine pitch
Electronics Forum | Mon Mar 22 07:40:01 EDT 2010 | emanuel
Are you absolutely sure the problem is with the humidity? We had a problem with 3528 size leds, damaged by the pick and place nozzle because a 0.2mm mistake in the height measurement. Also, we found that several suppliers are using fake desiccant ba
Electronics Forum | Mon Aug 16 14:43:44 EDT 2010 | dan_ems
Hello, i don't know if is possible to dispense paste but for reduction of cost we use a diferent type of stencils, from aluminium of 0,2 mm, purchased from a typography of newspapers. Ofcourse the pcb for what we use this stencil are simple. But th
Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Fri Dec 27 16:12:54 EST 2019 | anteiv
thank you for reply here is picture of the board https://imgur.com/a/i2MfFBw on the bottom are pins/components which height is about 3-4 mm from bottom of the board we had to increase distance of board from nozzle to make clearance and we increas
Electronics Forum | Fri Sep 11 15:58:50 EDT 2020 | majdi4
You haven't communicated what thickness of stencil you are working with ... it's interesting to know..at first, you need to reduce the amount of CAB deposited because with 1X1 stencil aperture size you are depositing an amount important CAB .. so, I
Electronics Forum | Fri Sep 05 06:17:36 EDT 2014 | edriansyah
Hi, We have a problem with our BGA Pad. Our PWB manufacturer make the BGA Pad in irregular form. some big, some small. Please see the picture on attachment. BGA Detail BGA Pitch 0.5 mm BGA Ball 0.3 mm BGA Pad (big) 0.2 mm (as per gerber) BGA
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
