Electronics Forum | Thu Jun 14 21:48:41 EDT 2012 | kmots15
We work with a lot of larger boards over 24", haven't run into this issue yet. I agree with scott could be your board supplier if they are lower quality, from something as simple as unit conversions in CAD to dealing with different temperatures. A
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Sat Dec 14 02:29:52 EST 2013 | padawanlinuxero
Hello I hope this helps For a component with axial leaded - vertical The clearance of the component body or weld bead above the land is 1.00mm (0.039in) Component body must be perpendicular to the board The overall height does not exceed maxim
Electronics Forum | Fri Feb 22 10:46:04 EST 2008 | mulder0990
Yes, we have. We do have one machine that can place the 0201 parts. I have bought some 0.4mm tape leaf covers and replaced the 0.7mm covers on some CP6 0802 feeders. I calibrate the feeders as tight as I can and make sure the feeders that we use a
Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet
I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h
Electronics Forum | Thu Jan 05 01:44:22 EST 2017 | soldertraining
In modern education, almost every Electronic Engineer must design a PCB. Once you get to know PCB design tools and functions, then creating a layout will become easier. Today, we find 0.4 mm pitch BGAs in every smartphone, and 0.3 mm ultra-fine pitch
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Tue Aug 23 22:50:09 EDT 2005 | adeline_ko
My process guy told me that. Due to black spot issue, brd with BGA must use electrolytic finishing. And when we had this finishing with plug via, the blister issue pop out. My supplier claim that this is due to the plug via. Which I don't know how
Electronics Forum | Thu May 04 04:47:28 EDT 2006 | rlackey
Hi Pat, Not going to change, but has changed. We were first notified about a potential change 2 years ago, but as we're such a volume user we could turn around and say no thanks. However as every one else has now changed over on commodity parts &
Electronics Forum | Tue Jun 09 07:23:04 EDT 2020 | ameenullakhan
Hi Team, Please help in suggesting stencil aperture opening for the 0.4 mm pitch BGA. PAD Diameter is 0.24mm. we have 0201 components also in same board. We have HIP in this BGA. Solder paste : Alpha Om5300 ( PB+ solder paste ) type 4 We have tr
