Electronics Forum | Mon Nov 04 17:29:34 EST 2002 | pjc
Cannot comment on "best buy". You'll have to determine what the better machine is for your application and duration of planned use. I suggest taking a field trip to each vendor's nearest demo facility with a few of your most hi-tech boards and stenci
Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
Electronics Forum | Fri Mar 03 06:41:09 EST 2000 | jacqueline coia
I have tried the IPC calculator and they do not have this type of component registered. When trying to select 'other' on menu, no connection can be made. The polarity if the QFP has not been decided yet (pre-PCB design) the pitch size of the componen
Electronics Forum | Wed Jan 31 01:41:00 EST 2001 | pjc
Steve, I have no influence over conn design. We paste print-reflow solder two types of connectors. One is a 50 pin IDC w/ 0.5mm lead dia @ 2.54mm lead pitch and a chamfered pointed lead tip. The other is 32 pin DIP w/ 0.36mm lead dia @ 2.54mm pitch
Electronics Forum | Sat Mar 12 18:32:29 EST 2011 | jlawson
It is pretty hard to wave solder fine pitch parts bad enought with 0.5mm let alone 0.4mm It can be done but need N2 inert wave soldering & need layout design to accommodate this... Iy it is a QFP need to run part 45 deg into wave and if possible in
Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc
SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no
Electronics Forum | Fri Jan 10 00:56:53 EST 2003 | fastek
You really must be on a tight budget since most people will pay YOU to take these models off their hands. What is your budget for capital equipment? Zero? That said, I think you would be better served to step up a generation and look at MPA-3's inste
Electronics Forum | Mon Mar 25 21:50:10 EST 2002 | davef
Some of this was copped from Fred. There are numerous package types that now fall under the rubric of land grid array [LGA]. Land grid devices [ie, Bumped Chip Carrier� [BCC], LGA, Quad Flat-pack No-lead [QFN], MicroLeadFrame�, etc] are essentially
