Electronics Forum | Wed Dec 30 16:04:15 EST 1998 | former co-worker of yours
| I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. | | My current 0402 chip pad sizes on alumina and FR4 substrates are .
Electronics Forum | Wed Jul 22 11:27:25 EDT 1998 | Russ Miculich
I agree with the response and strongly recommend that you use the "home plate" design to reduce solder ball entrapment, and that the under cut for the 0402's in particular be 80% of the pad size. Solder slump is typically about 1.2 to 1 so spread wi
Electronics Forum | Mon Jan 29 15:49:08 EST 2007 | rmitchell
Hi, Our Fuji CP65 nozzles are jamming in the up position. Mostly on caps and resistors, the .7mm (0402) and 1.0mm (0805) and 1.3mm (1206) sizes. They seem to be catching internally where the little peg slides down the slot. If you twist them they
Electronics Forum | Thu Jan 17 20:33:05 EST 2002 | ianchan
Hi, Can anyone help explain the benefits/disadvantages of bareboard pcb baking, as part of the pre-heat conditioning, before the bareboard pcb use in SMT production run? The pcb board is 200mm x 240mm panelized pcb board, and has 28 smaller pcb boa
Electronics Forum | Fri Oct 13 13:44:03 EDT 2000 | Mike McMonagle
You can achieve a wide range of dot heights when stencil printing by using a polyimide stencil along with a .040 snapoff. Loctite has a system for this that they call Varidot, by varying the size of the apertures in combination with the .040 snapoff
Electronics Forum | Thu Mar 01 22:59:30 EST 2001 | Cosine Theta
I am surprise that you get 99.5% pick-up rate out from the HS-50, unless you are refering to 0201 chip size. I can easily get 99.8% for 0603 and 99.6% for 0402 out from a Panasonic MV2F, and these machines have no adaptive pick-up. To get 99.8% from
Electronics Forum | Fri Apr 07 01:39:03 EDT 2017 | tsvetan
This parameter is in the component library, you do not change the force but the time when to start air blow. It's described in SM482 administration manual in component library programming IIRC. For what component size you want to do this change? In t
Electronics Forum | Wed Jun 11 16:41:57 EDT 2014 | isd_jwendell
With Essemtec software you can specify to turn on vacuum once the nozzle is down at the part. The default method is to turn on the vacuum while the nozzle is up, but starting to move down. For light/tiny parts this can have the effect of making them
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Fri Jun 27 15:37:02 EDT 2003 | caldon
Charlie- You answered your own question...1206, 0201, 0603, 0805, 0402 are all the package dimensions. In addition Here is a generic link from practical components that list most package sizes, feeder size, tape type... http://www.practicalcomponen
