Electronics Forum | Tue Mar 21 02:15:26 EST 2006 | pavel_murtishev
Good morning Dave, Here are some of my assumptions. Please correct me if I am wrong. 1. Mask opening. Due to mask to PCB misregistration mask is not always centered relative to pad center how is should be. Sometimes edge of the mask matches with ed
Electronics Forum | Wed May 24 16:01:08 EDT 2006 | samir
GEB, Datasheets are usually just guidelines and most App. Engineers from paste companies will tell you that as well. You don't have to "copy exact" what they say, but rather set your oven to what gets you and your type of boards the best results. P
Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala
your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2
Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL
Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces
Electronics Forum | Thu Dec 21 15:13:16 EST 2017 | georgetruitt
Is the process the same for every product running through the selective solder machine? Load program, acquire or set up fixture, Change/load flux?, Change/Load solder pot? Are the machines cold when the operators need to use them or are the machin
Electronics Forum | Thu Feb 03 21:17:07 EST 2000 | Dave F
AF: Unfortunately, there is no "acceptable number of cycles" either in air-to-air and one liquid-liquid thermocycling, nor interconnect stress testing. There can be a "minimum threshold" that would assure no failures as the result of the assembly p
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
Electronics Forum | Tue Apr 13 18:39:24 EDT 1999 | Tom B
| | Netters, | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | 1. Kester 293 no clean | | 2. 2.1 C/s for 30s to 150 C | | 3. .5 - .7 C/s f
Electronics Forum | Tue Apr 13 23:08:56 EDT 1999 | Jeff Sanchez
| | | Netters, | | | | | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | | | | | 1. Kester 293 no clean | | | 2. 2.1 C/s for 30s to 150 C | | | 3.
Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185