Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele
I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Nov 12 04:40:03 EST 1998 | Galen
| Scott - Good to see things are going well for you. With regard to your comments, Quad has introduced a complete line of Semi-conductor/APT machines (Q Series) that support both SMT and Semi-conductor applications. The machines were introduced in
Electronics Forum | Wed Sep 23 20:42:10 EDT 1998 | Steve Gregory
Boy Chrys, aren't you lucky? Too busy to mess with that stuff huh?...must be nice!! Ya' know, it doesn't say much for the design, or the design-er when you see a bunch of wires on board, but if the person who does the jumper wires is good, and take
Electronics Forum | Sat Aug 29 08:43:35 EDT 1998 | Dave F
| Hi, Friends, | Could you please recommend me some solder mask materials and equitements for high quality solder mask? Details such as company name, phone numer et al are welcomed. Thanks! | Have a good day | Xingsheng Xingsheng: Consider the follo
Electronics Forum | Tue Dec 04 08:34:07 EST 2007 | davef
We no advice to give you on the topic, but maybe while you're waiting for others to reply, reading a trade journal article on the topic might help. Below is a link to "Pin-in-hole reflow (PIHR) and lead-free solder joints" by David Bernard, Bob Willi
Electronics Forum | Fri Feb 26 19:27:04 EST 2010 | dcell_1t
you can find a very helpful guide here... http://www.oee.com/pdf/oee-pocket-guide.pdf We basically have a database where operator input the boards produced per hour and if he can't reach the "standard" he can input a downtime issue and assign to a
Electronics Forum | Fri Jan 24 09:52:08 EST 2014 | davem
Hi Guys, So I work for a small contract manufacturer which caters mainly to the defense sector. As such, our customers haven't (yet) had a great need to incorporate 01005's into their designs. Looking forward, we decided to "take the plunge" and dia
Electronics Forum | Wed Sep 22 22:23:55 EDT 1999 | SY
| | | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | | | thanks | | | | | | | | | We use 6
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
