Electronics Forum | Wed Dec 02 21:58:19 EST 1998 | Dave F
| | I am looking for a few PBGA 560 1.27 pitch Components. If anybody has any lying around I could buy. So that I may profile to my hearts content. | Thanks | Mike Cox | Mike: The best I can offer is contacts at dummy component suppliers, wh
Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Wed Apr 14 20:48:43 EDT 2004 | Ken
Just a thought.... Some Fluxes require temperatures upto 260F (127C). Are you using water based flux or solvent (alcohol). I have noticed that many wave machines are NOT capable of preheating adequately when using water based materials. This can
Electronics Forum | Fri Jun 24 13:34:41 EDT 2005 | thaqalain
I have Intel� Pentium �4: BIOS VER: LY84510A.86A.0029.P11 Processor:X86Family15 Model 1 Stepping Processor Speed: 1.8 GHz System Bus Speed: 400 MHz System Memory Speed: 133MHz Cache RAM: 256KB Total Memory: 127MB (76%Load) DIMM Memory Connect
Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Fri Mar 09 18:32:29 EST 2007 | siverts
We have seen this issue with our RoHS process also. If that is the case and I if understand you correctlcy; then the advice from KSimpson, Stephen, DaveF + "all others" is totally correct!! We have been under this problem a numeruos numbers from time
Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Wed Jan 30 14:11:15 EST 2008 | slthomas
We dodged it for a while but it was inevitable. Here's the question. What do I REALLY need, and does anyone even agree on it? OK, that's *two* questions. The first board we're likely to do has three parts that will need special consideration. One
Electronics Forum | Tue Sep 16 12:16:45 EDT 2008 | mw_fl
Thank you for your comments and questions. Did not realize that they charge for the registration. Was just reading some info on the service contracts through Contact Systems and saw they required the system to be registered. One of the brokers that
