Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley
Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are
Electronics Forum | Fri Feb 01 19:12:18 EST 2013 | marcelorotofrance
Hi, I have a QUAD 4C mk2. I taught pickups and places from HHT. If I test them individually (RUN STEP PICK/PLACE etc...) before building the sequence, everything runs ok. After the sequence was built, everything goes wrong. Every PICK or PLACE ends i
Electronics Forum | Wed Oct 15 17:20:57 EDT 2008 | mbrunton
2, I have to scroll down to the bottom to see the image... and the outline of the legs isn't very clear. The legs are sort of blurred together. I had tried lowering the CCD offset in the part definition to -50, but it still looked bad. Could this
Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry
We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti
Electronics Forum | Mon May 12 15:13:29 EDT 2014 | emeto
Thank you guys. As we are speaking I keep examine the problem and here is what I got so far. 1. I measured the temperatures on my profile and the lead is hotter than the board. The lead goes 12 seconds earlier than the pad and is taking the solder.
Electronics Forum | Wed May 31 00:43:59 EDT 2000 | Ashok Dhawan
Dear SMTnetters I am using EIA-625 : 1) I was just wondering whether I should be putting ESd Labels for each workstation ( Station #s) In addition to standard ESD protected workstations, I am using chair, mini-tables, carts, shelvings... for handl
Electronics Forum | Fri Apr 06 11:37:19 EDT 2001 | raton
We had the same problem years ago when we started using a radial inserter. The inserter would dutyfully insert and clinch the leads. The problem in our case was the component body sealing to the fab, especially on electrolytics caps with a film jac
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
