Electronics Forum: 20-30 (Page 9 of 14)

Sn/Pb diffusion

Electronics Forum | Mon May 20 10:49:12 EDT 2002 | geoff_goring

Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? In our case we are being told that this process is starting before assembly. Is it fundamentally the same thing. i.e. will the Tin diffuse with th

Standard kit in LVHM environment

Electronics Forum | Mon May 12 10:14:04 EDT 2003 | gregp

Hello Stefan, Thank you for your reply. I see now that manufacturers are aware that this kind of thought process is necessary for the bottom line profit. It is also true that one can be "seconds wise and minutes foolish" in the process. I read with

Quad IIIc/IVc programming question

Electronics Forum | Wed Aug 10 20:30:49 EDT 2005 | slthomas

I've got a new board (actually a new panel...a 4 up, with one row rotated, where it was a 2 up panel with no rotation before) that runs fine on the IVc but not on the IIIc. I've used the same reference points for the image rotation (fiducials) on bot

Epoxy on bottom of SMT component

Electronics Forum | Mon Dec 03 20:30:58 EST 2007 | shy

Q: I thought you said that the parts that weren't wetting in reflow were the parts with epoxy. A: Yes you're correct. Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in ref

Baking assemblies after ultrasonic water wash

Electronics Forum | Thu Jun 11 10:02:36 EDT 2009 | dyoungquist

Our cleaning process involves the assemblies being completely immersed in the water bath of the ultrasonic cleaner. The assembly has a QFP44 on it. Customer stated that when these assemblies have been cleaned with water in the past (at a different

MSD Storage

Electronics Forum | Thu Nov 08 04:33:39 EST 2012 | grahamcooper22

Make sure that the 40 degree C oven is getting to less then 5% RH inside especially for any applications where you need to dry components....it may surprise you that many ovens set at 40 C will have an internal RH of @ 20~30%....and that is not dry e

Trouble selective soldering fine pitch connectors

Electronics Forum | Wed Dec 12 16:12:58 EST 2012 | tombstonesmt

Glad to hear we have more Jade users on the forum! What kind of flux footprint is your fluxer leaving on the board? You called it a "spray" fluxer.. We use the MIC fluxer that functions like a jet fluxer. Do you flux each individual lead or do a

Solder past KOKI out of date. Can it be reviving

Electronics Forum | Mon Mar 24 20:30:01 EDT 2014 | davef

The "correct" answer is: Use the tests and methods that you used to qualify your solder paste in the first place. That sounds good but might not be all that practical for practicing assembly-types. Here's something that's not as good, but will give

Flexjet3 No Nozzle Detected During Dropoff

Electronics Forum | Fri Jul 14 17:32:36 EDT 2023 | ttheis

Having an issue with changing nozzles on one of our FJ3 heads. We get errors on spindle 5 and 6 when bank-changing nozzles. Event code 31208, unable to find any info on this code. When we use the put nozzles away routine it does it no problem but has

Re: Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 10:48:02 EDT 1999 | Earl Moon

| Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody hel


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