Electronics Forum: 2mm (Page 9 of 25)

minimum solder ball (bead) size

Electronics Forum | Tue Jun 06 15:45:18 EDT 2006 | slthomas

Yep. What I'm really looking for is the minimum radius of curvature for 63/37, which is a function of it's surface tension. It's physical properties issue, not an agency issue. I've seen some references that I have interpreted to mean that it's some

BGA Aperture

Electronics Forum | Wed Jun 20 08:14:36 EDT 2007 | pavel_murtishev

Good afternoon, You should use overprint technique if you have any problems with paste volume (PIH technology and mixed designs, for instance). Otherwise, it is useless. Overprint has to be made in such way so that paste would have an ability to flo

Land size

Electronics Forum | Mon Jul 07 13:33:40 EDT 2008 | realchunks

Most QFP 128s have a 0.16mm wide lead. Might have to modify your pads if you'r buying some odd ball part. But generally 0.2mm should be OK for this part. You may never get good toe wetting. Most QFPs are cut apart after plating, thus the toes are

BGA Rework - flux dispensinx issue

Electronics Forum | Tue Nov 04 04:00:38 EST 2008 | Martin

Hi All, Anybody knows good, repetable method of dispensing flux for micro BGA rework? 6x6 mm(0.5 mm pitch) The flux dispensing amount by brush may vary depending on operator etc. If operator dispense too much flux the BGA "swim".Around the BGA compon

Fiducial Recognition

Electronics Forum | Wed Sep 01 08:16:55 EDT 2010 | sachu_70

Drill holes or tooling holes have higher tolerances than Fiducial marks during PCB fabrication. I would certainly recommend Fiducial recognition as a more reliable approach for better accuracy. You could re-calibrate the Vision system file used for

Fiducial Recognition

Electronics Forum | Fri Sep 03 03:49:24 EDT 2010 | sachu_70

In case of pure pattern recognition, i agree with your view. However, the basic functionality of the fiducial is determine any positional offset of the PCB and provide necessary data for correction during the intended operation such as Paste printing

Improving PTH fill using select solder

Electronics Forum | Tue Dec 18 10:14:14 EST 2012 | moshesh

In those cases where we have a 3.2mm thick, 16-layer board with several GND layers, do we still need ground connection to each and every layer (with thermal relief) or, skip part of the ground patterns? Will it help soldeing rising. I can't reach mor

paper vs emboss (& zig zag placement)

Electronics Forum | Tue Oct 02 10:30:10 EDT 2012 | eniac

Difference in pick height from paper and embossed reel (typically) is 0.2 mm. Try to change your pick height and place height (different type of capacitors have a different height: for 100 nF 0603 and for 4.7 uF 0603 it's a big difference!). Can you

Paste printing fine pitch components

Electronics Forum | Sat Oct 12 13:49:08 EDT 2013 | garym4569

Has anyone had success using a DEK Proflow printhead with fine pitch components (~.2mm pitch). I have been told that squeegees are the way to go for fine pitch. What other major factors play a role in successfully printing fine pitch. Print speed,

FUJI CP8 PLACING 01005

Electronics Forum | Wed Mar 18 22:52:15 EDT 2015 | mdang

What nozzle size do you use to place 01005 on Fuji CP8 machine? The smallest nozzle size on the CP8 is 0.4mm. Could we use this nozzle to place 01005 since the size of 01005 pacakge is 0.4mm x 0.2mm. Thank you for your help, -Michael


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