Electronics Forum: 40 and oven (Page 9 of 66)

Stencil cleanliness and inspection

Electronics Forum | Thu Jun 07 13:40:12 EDT 2001 | kerryn

Dave, We have very short runs (less than one hour). We have stencils all over the place waiting to be cleaned. It is too time consuming to scope each stencil to inspect for cleanliness. Do you know of any automated or scanning devices that can ra

solderability and hasl thickness

Electronics Forum | Tue Sep 09 18:07:18 EDT 2003 | davef

We would be very wary of allowing 50 uinches, because this will likely result in reduced shelf life due to intermetallic growth. As a guesstimate, at least 10 uinches of that 50 uinches, and maybe more, is already intermetallic when you receive the b

0402's and Gluing.............

Electronics Forum | Thu Feb 10 09:01:40 EST 2005 | russ

I have done that also, It does work well. One issue we had was that the mask didn't come right off during the first wash cycle since it was put on much heavier than the mfgr suggested (.01"). We had to soak them in some water first to soften it up

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

SAC305 and Selective Soldering

Electronics Forum | Tue Sep 17 15:40:59 EDT 2013 | 18424

Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a

BGAs and vapor phase

Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY

Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi

Skewed and popped components

Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie

We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.

Immersion gold and BGAs

Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya

I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 07:44:41 EST 2008 | tonyamenson

So just to clarify.... If i bought a KIC 2000 I could run that one unit over both my waves and through both my ovens (leaded and lead-free)? Or would I need additional equipment to use it on the wave?

NADCAP and thermocouple calibration

Electronics Forum | Wed Aug 07 12:35:36 EDT 2013 | cyber_wolf

I was asked how we verify that the thermocouples INSIDE the reflow oven are calibrated. That seems pretty impractical to me. Has anyone come across this ?


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