Industry News | 2012-01-24 16:38:24.0
Juki Automation Systems will celebrate its 25,000th machine shipped worldwide and its 25-year anniversary in the SMT placement industry in Booth #1137 at the upcoming IPC APEX Expo.
Industry News | 2012-06-01 12:54:18.0
Juki Corporation, will participate in Juki’s 25,000th machine shipped celebration that is being held in conjunction with the upcoming JISSO PROTEC 2012 exhibition,
Industry News | 2021-03-01 03:53:54.0
PENANG MALAYSIA - February 2021 - ViTrox Technologies, the most trusted Machine Vision inspection solution provider of innovative, advanced, and cost-effective automated Machine Vision inspection solutions for the semiconductor and electronics packaging industries is exhibiting in the virtual IPC APEX EXPO 2021 from March 9th until 11th, 2021.
Industry News | 2002-10-25 15:18:45.0
Sanyo Surface Mount equipment
Industry News | 2018-03-16 08:13:49.0
As a leading solder materials innovator, Henkel recognizes the need for more holistic solder paste process analysis, especially as device miniaturization and finer particle size solders become mainstream. While many suppliers and manufacturers use proprietary solder material evaluation tools, there is a requirement for easily-implemented, standardized test vehicles that address the realities of today’s manufacturing complexities, particularly in the process areas of printing and reflow. The electronics business of Henkel Adhesive Technologies has developed such a tool.
The KE3010 is a 7th generation modular placement machine from Juki and represents the latest leading-edge technology for improved flexibility and production quality. It supports a hybrid feeder mix of electronic and mechanical feeders with up to 160
The USS Vision Exact Scan™, featured on the National Geographic Channel, is a high-performance, patented machine vision inspection system that scans multiple features at super-high resolution (4,000 x 9,000 pixels). The system consists of a unique vi
New Equipment | Test Equipment
Megger Model# 6411-038 Catalog# 655535P General Purpose Time Domain Reflectometer 9 Ranges (0-150 ft. to 0-48,000 ft.) The Biddle Megger 655535P is an advanced instrument capable for identifying a wide range of cable faults using Time Domain Reflect
New Equipment | Fabrication Services
Specifications: Size (L x W): 50 x 50 to 700 x 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74x74mm Service include: PCB layout and BOM design or
New Equipment | Fabrication Services
Specifications: Applicable PCB (L x W): 50 × 50 to 700 × 460mm Minimum component: 0201 Minimum QFP pitch: 0.4mm Minimum IC pitch: 0.30mm Minimum BGA ball diameter: 0.40mm Ball pitch: 1.0mm Maximum BGA size: 74 x 74mm Services include: PCB layout and
