Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane
i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red
Electronics Forum | Fri Aug 24 11:03:15 EDT 2007 | hussman
I agree with Joris. But to add to his comment, the type of finish also has a direct affect to your wave solder process. Going from a gloss finish to a matte finish may help a lot. As for humidity affecting your wave - I doubt it. I use a water
Electronics Forum | Wed May 07 15:36:04 EDT 2008 | llaerum
The 483 is what we use on all boards except on one where the 353 improved wetting on resistor packs. It worked much better since the parts are LF and this is the same flux AIM uses in their LF solder. Yes, it was recommended by AIM when we discussed
Electronics Forum | Thu Oct 27 20:37:49 EDT 2011 | tech1
the calibration error sounds like it is an electrical verifier issue. Are you testing parts before you place them? It could be that your centering electrodes are worn or dirty, or it could be the ribbon cables from the centering unit. If you are usin
Electronics Forum | Thu Aug 08 19:20:08 EDT 2013 | hegemon
I too am hoping a NADCAP guy might jump in here. I would like to know how this portion of the question is handled. Evidence of PM, periodic cleaning of EQ and tools, no issues. Thermocouple calibration? You would think that evidence of Oven CAL
Electronics Forum | Fri Jul 23 10:47:31 EDT 1999 | Mark D. Milward
There is a practise within the industry of an Inspector inspecting a board, and that same Inspector performing touch-up. My opinion is that the Inspection and Touch-up operations should be separate functions whereby the Inspector is not performing th
Electronics Forum | Thu Mar 03 11:49:23 EST 2005 | Rob
Doesn't that depend on your company's culture & management style? We (and I feel slightly dirty using this word)empowered our end of line inspection/touch up people & trained them to know what is good or bad - so issues can be immediately fed back,
Electronics Forum | Wed Mar 12 07:33:40 EDT 2008 | callckq
Hi All, One PCBA failed test after went through the Shock Test(Vibration) and suspected to be BGA solder ball crack. We performed dye and pry and found PCB's pad lifted with red mark ink penetrate pad underneath, what does this mean? Can I say the
Electronics Forum | Wed May 07 10:15:46 EDT 2008 | llaerum
We are also having some issues with certain small parts. In our case this is tantalum caps and 0402 caps. We had a vendor admit after much discussion that the plating used from a particular orgin was different on the tantalums. The tehory is thatthsi
Electronics Forum | Wed Jan 12 13:42:19 EST 2011 | dwonch
Hi All, I'm hoping there is a PCB expert or two hanging around. We're having some solderability issue on our boards. The finish is ENIG but it doesn't seem to be related to the finish process itself. We did SEM and EDX analysis and found aluminum an
.gif)
