Electronics Forum: approach (Page 9 of 68)

Stencil maintenance approaches

Electronics Forum | Thu Sep 09 18:02:42 EDT 2021 | emeto

Stencil thickness could be 3,4,5,6 mil but stencil is framed on 29 inch frame for SMT printer machine. I want to measure thickness in the center of this frame.

Stencil maintenance approaches

Electronics Forum | Thu Sep 09 20:48:12 EDT 2021 | laserstencils

I do not know of a way to measure the nano-coating. However, it is easy to check if it is still on the stencil. Simply use a 'sharpe' pen and try and mark the bottom (PCB) side near any openings. If it easily marks, then the nano is no longer present

Stencil maintenance approaches

Electronics Forum | Thu Sep 09 21:35:08 EDT 2021 | tey422

You don't really need to measure the center's thickness unless there is where the step up/down is at. As long as you can measure the the outer edge of the stencil, it would be the same thickness.

BGA Square Aperture Formula

Electronics Forum | Mon Jul 03 13:02:19 EDT 2023 | fuji_user_2014

There are some "rule of thumb" design approaches for circle apertures for BGA's. Does anyone use rule of thumb formulas for square/squircle apertures for BGA? If so, what are they?

BGA Solder Short

Electronics Forum | Mon Jul 17 01:45:32 EDT 2023 | hazira1991

Hello, Im currently having BGA solder short issue which happen only at the center of the BGA during fresh production run. During rework using SRT also i did encounter the same solder short issue. Kindly provide your thoughts on this as how to appr

Re: PCB finishing

Electronics Forum | Thu Apr 13 20:18:14 EDT 2000 | Dave F

Pete: What�s a "free issue PCB panel"? Is that like "consigned material" here in the states? In response to your question, several possible approaches (in no particular order): 1 Router approach: 1a Wood working router * Go over to Sears and buy a

Solid Solder Deposit

Electronics Forum | Mon Apr 23 22:48:50 EDT 2001 | davef

Cal is correct. Sipad, Precision Pad, Optipad, SSD, and all that were a feeble Euroland approach to creating flat pads for fine pitch assembly. To begin with, they required a complete board redesign using their proprietary software. [Oooo, me firs

Misprint PCB Cleaning

Electronics Forum | Mon Aug 06 12:14:35 EDT 2001 | seand

Hello All, The audacity to yell Smartsonic here is appauling. This is a process approach dependent on the type of epoxy. To suggest your equipment without knowing a thing about the process is shameless. OK, now I'll get off my soap box. The low

Re: 45 Degree Wave Soldering

Electronics Forum | Mon Mar 01 15:29:16 EST 1999 | Chad Haima

| A rash of new products here at my company have designs with multi-pin connectors 90 out-of-phase (orientation)wiht respect to wave direction, which has lead to massive bridging (shorts) problems.... | | Does anyone still use the 45 Degree Pallet

Re: Solder paste stencil modification

Electronics Forum | Wed Jan 20 20:29:17 EST 1999 | Tony A

| | Bernie, Steve Gregory approach is the simplest solution. But,If you ever get yourself into a real bind and need an array of holes added and the cost of a new stencil is astronomical. Approach Hamlet at BeamOn. I have seen him add and enlarge hole


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