Electronics Forum | Thu Feb 07 13:53:38 EST 2013 | hegemon
I would consider wave solder as a cycle, in that for the most part the entire board is subject to the wave. Selective Solder is a gray area in that regard, since you will be hitting one or more locations, that in total do not comprise a large percen
Electronics Forum | Fri May 20 08:04:30 EDT 2016 | milroy
Hi All I have a need to calculate the Aperture area in a stencil with in a very short time without going in to a CAD viewer. I need that when I insert solder paste file in to a certain software application and that application software calculate the
Electronics Forum | Fri Aug 23 02:29:16 EDT 2019 | sssamw
It seems because the soldering area is not enough, so the wetting force is small to hold the switch, remember >0.08g/mm2 for each part as in IPC standard. So, anyway, you need increase the soldering area to reduce weight/area number to below 0.08g
Electronics Forum | Fri Jan 10 03:57:37 EST 2020 | jakapratama
Hello, When I calculate based on the data you gave, your stencil aperture area compared to pad area is 94.52%. Your aperture area ratio is 1.76 using 5 mils thickness foil. OK, your stencil and your paste release is not the culprit here. Your proble
Electronics Forum | Fri May 28 13:03:14 EDT 2021 | cbart
I'm honestly not sure IPC addresses this? the one thing i would ask myself if it were my issue: is the effected area in the critical contact area of the finger/contact? in other words if its low on the finger where the bevel was applied i bet its not
Electronics Forum | Thu May 04 05:04:04 EDT 2000 | Richard Durrant
I have a few lcc devices that have large metal areas on their bases that require them to be soldered to the board for thermal and electrical reasons. I have provided a large copper pad and thermal vias, but how do I describe the solder stencil inform
Electronics Forum | Fri May 05 05:51:44 EDT 2000 | Joe
Thanks for the info. Our system is capable of holding the set limits, but since breakdowns do happen I am considering what to do. So while everything is running, we have a climatic controlled area. The min. relative humidity of 40% comes from the JE
Electronics Forum | Tue Mar 21 16:25:23 EST 2000 | Boca
Full radius corners on pads can help with solder paste release in the stencil. The radius shape minimizes the surface area in the wall of the stencil aperture as compared to a sharp corners. When the stencil is seperating from the pcb the solder pa
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
