Technical Library: article (Page 9 of 163)

Unleash Efficiency with Our SMT Flexible Pick and Place Machine

Technical Library | 2023-09-16 07:13:46.0

Experience enhanced flexibility and precision in your assembly line with our state-of-the-art SMT flexible pick and place machine. Optimize production today.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

SMT LED Pick and Place Machines: The Essential Guide for Manufacturers

Technical Library | 2023-09-16 07:15:41.0

SMT LED pick and place machines are essential for manufacturers of LED products. These machines can place LEDs quickly and accurately, making them ideal for mass production.

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

Craftsmanship Meets Precision: SMT Manual Printers

Technical Library | 2023-09-18 03:44:40.0

Unleash the art of PCB assembly with our SMT manual printers. Elevate your craftsmanship and achieve precision in solder paste application. Discover our reliable solutions today!

I.C.T ( Dongguan Intercontinental Technology Co., Ltd. )

An Alternative Dispense Process for Application of Catalyst Films on MEA's

Technical Library | 2008-10-01 14:02:27.0

This paper proposes an integrated system for film application process than consists of closed loop mass calibration to assure film thickness, a noncontact fast jetting process with high edge definition capable of applying films for highly selective areas and patterns. A system to obtain homogeneity of the solid-fluid mix is described and results are shared.

ASYMTEK Products | Nordson Electronics Solutions

SMT Preventative Maintenance: Nozzles

Technical Library | 2009-04-23 08:14:37.0

No SMT equipment can place accurately and run efficiently without quality nozzles and feeders. These two factors are the core of the pick and place process. If the machine is either unable to pick parts consistently or hold on to the components during the transport from feeder to PCB, defects will result.

Count On Tools, Inc.

Scaling LCA with IPC-175x

Technical Library | 2012-06-07 21:44:28.0

First published in the 2012 IPC APEX EXPO technical conference proceedings. IPC-175x Intent: To establish a standard data exchange format that will facilitate, improve, and secure data transfer between all members of a supply chain.

Association Connecting Electronics Industries (IPC)

Understanding the Heat Output of your BGA Rework Station

Technical Library | 2018-04-27 13:23:31.0

When performing BGA component rework, it is important to know the actual heat that is coming out of the top and bottom heaters. This will be critical in setting up accurate heat profiles. Monitoring your heat output will also keep you aware of your heaters performance so that you will know when the heaters need to be replaced.

Precision PCB Services, Inc

Identifying Battery Load Qualification Test Parameters

Technical Library | 2019-05-30 11:02:07.0

In a previous Tech Tip (see Battery Selection for Electronic Systems), considerations were discussed for selecting an appropriate battery for an application. After selection, testing should be performed to confirm that the battery can provide the power required for the specific application. Some battery definitions should be understood when discussing power load qualification testing of batteries.

ACI Technologies, Inc.

Component Failure Analysis - Hermetic Packaging

Technical Library | 2019-06-11 09:34:37.0

Recently ACI Technologies was asked to perform failure analysis on a hermetically sealed transistor for potential electrostatic discharge (ESD) or electrostatic overstress (EOS). ACI was asked to determine if the field-failed transistor was damaged by ESD or EOS. In order to properly assess the failure, additional samples were requested.

ACI Technologies, Inc.

Reflow Experiment

Technical Library | 2019-06-11 09:36:13.0

An experiment was recently performed ACI Technologies for a customer that was interested in comparing the wetting of lead-free solders with varying temperature profiles and atmospheric conditions. In order to deliver an objective measurement of solder wetting (in addition to subjective inspection analysis), a simple wetting indicator pattern was added to the solder stencil in an area on the test vehicle that had exposed and unused copper.

ACI Technologies, Inc.


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