Full Site - : backward solder (Page 9 of 11)

Au Plating

Electronics Forum | Mon Jun 03 21:02:42 EDT 2002 | ianchan

Ok let's start backwards abit, and move progressively from a common understanding. So this originator thread-slinger bloke is asking for advise to Au plate his connector pads. We have a cuppa ideas bounced around which leads to my ignorance based q

Reflow Profile Design

Electronics Forum | Fri Jun 15 12:08:49 EDT 2007 | ck_the_flip

Hi Grant, 1st off solder paste data sheets are just "guidelines". You always need to set your specs. based on the needs of your own process and product. Don't ever follow your solder-paste data sheet to the tee, or you're severely limiting yoursel

Problems with TI DSP modules

Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef

1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee

| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony

| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi

BankeemChheda-Resume

Career Center | Rochester, New York USA | Engineering

I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research

Re: BGA's - Re-ball -- How thick?

Electronics Forum | Tue May 18 16:24:25 EDT 1999 | Scott McKee

| | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-st

Incoming Water Quality

Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef

The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound

Re: Flux sprayer set up

Electronics Forum | Thu Dec 23 22:31:47 EST 1999 | Vincent Chen

Hi!Charlie, 1.Are you retrofitting your spray fluxer in your wave soldering machine? If you are, please ensure that you have a air knife just before the preheater!Fluxe fumes tends to accumulate and that could be dangerous if your air exhaust is not

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Sat Mar 21 12:10:03 EST 1998 | Philip C. Kazmierowicz

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's


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