Electronics Forum: baking and msl (Page 9 of 11)

Baking SMT Components

Electronics Forum | Thu Jul 17 13:57:21 EDT 2008 | dphilbrick

The recommended bake temperature for components in Tape and Reel is 40C. If you use a bake temperature higher than that, the cover tape and other elements of the packaging will degrade to the point that it becomes impossible to reliably use an automa

MSL

Electronics Forum | Fri Jul 15 10:56:43 EDT 2016 | emeto

You always follow the MSL label(I attached the table). 1. Use parts 2. Reseal the parts that left. If exparation date is getting close: 1. Use parts 2. Bake the parts left 3. Reseal

Moisture Sensitive Solutions

Electronics Forum | Tue Sep 23 15:51:46 EDT 2014 | fuji_user_2014

Hi, I'm looking for the best value for storing moisture sensitive SMT parts. Here is the current situation: when the SMT operators leave at the end of the day, they store any moisture sensitive parts that are still in production in a low temp oven ov

MSL control

Electronics Forum | Thu Mar 16 22:19:38 EDT 2017 | deanm

First, reflow does not reset the clock for MSL exposure. The best solution is to run the second side before the exposure time expires. I am curious to know why they must sit for 40 hours. If that cannot be done, then store the assemblies in a dry c

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f

MSL control

Electronics Forum | Wed Mar 15 13:35:40 EDT 2017 | scotceltic

I have a double sided PCBA setup. I have MSL components on both assembly sides. When I run Assy Side one I am within the allotted hours remaining on the MSL component. I then wait 40 hours before running 2nd Assy side. By then the hours on the 1s

BGA Rework

Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette

Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in

Vapor Pressure at lead free reflow temperatures

Electronics Forum | Mon Aug 21 04:36:34 EDT 2006 | Rob

Yes, appropriate storage & component handling proceedures should be followed depending on the MSL (Moisture Sensitivity Level) class of the component. Some component suppliers are now marking the MSL class on the label, along with PBT (Peak Body

MSL Level 1 Component Question

Electronics Forum | Thu May 12 10:49:27 EDT 2016 | Bill Albright

If an electronic component with a MSL rating of 1 is exposed to an moist environment greater than the 85% relative humidity to the point where the packaging is wet, what is the risk level of using the device in a lead-free soldering reflow process?

MSL Level 1 Component Question

Electronics Forum | Fri May 13 17:28:43 EDT 2016 | dyoungquist

Depends a little on how long it was exposed to the wet environment as moisture absorption by electrical components is a very slow process. That said, MSL 1 rated components can be exposed to high humidity indefinitely and still not need to be baked.


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