Electronics Forum | Tue Sep 21 16:09:08 EDT 2004 | davef
Q1: What is "enough surface free energy"? A1: Look here for background: http://www.azom.com/details.asp?ArticleID=1575 Q2: How do I determine surface free energy? A2: We look at it a relative term. For instance, a semi matte finish on solder mask
Electronics Forum | Thu Jun 11 22:57:45 EDT 2009 | davef
NASA recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5�C before conformally coating. [NASA-STD-8739.1, �Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Electronic Assemblies,� August 6, 1999]
Electronics Forum | Mon Feb 09 09:00:17 EST 2015 | jax
Outside the MSD issues stated already (and I cannot provide a exact time not knowing multiple factors like Humidity levels, temps, exposure times, etc...) OSP might be the very worst finish to use in this scenario of side 1 / store on a shelf / side
Electronics Forum | Tue Sep 21 11:39:41 EDT 2004 | pabloquintana
Conformal coat a bare board to determine if there > is there is enough surface free energy from your > solder mask to prevent dewetting. Sorry for my ignorance, but what is "enough surface free energy"? How do I determine that? >* Bake a board
Electronics Forum | Tue Aug 25 08:04:26 EDT 2009 | davef
Trapped moisture can be a problem, and one standard recommends baking a PCB for a minimum of 4 hours at 93+/- 5.5ºC before conformally coating. [NASA-STD-8739.1, “Workmanship Standard for Staking and Conformal Coating of Printed Wiring Boards and Ele
Electronics Forum | Mon Aug 01 18:50:46 EDT 2005 | crishan
Hi Cecil, We using conformal coating in our manufacturing area, we did use to use Humiseal, others have been Bectron and Peters. We recentalt switched all lacquering to Peters, since it is lead free and it is a lot friendly than Humiseal. To answer
Electronics Forum | Thu Mar 03 12:57:10 EST 2022 | dontfeedphils
Probably need more info on the PCB and why baking before reflow processing is part of your process, but if you're baking before reflow it makes sense you'd bake before rework. Is there a reason you don't AOI before wash?
Electronics Forum | Thu Aug 19 19:04:55 EDT 1999 | Brian Wycoff
| | Can anyone help on the subject of de-wetting during the spray coating process. We use PC29M Parts A+B spray coating material, Humiseal tapes and masking dots, Marigold supertouch V70N gloves and Concoat CM533 liquid masking material. We also use
Electronics Forum | Sat Sep 26 22:08:07 EDT 1998 | Jeff Sanchez
I recieved a pack of sensitive IC's that said they needed to be baked befor certain processes. If I need to do rework, do I have to bake prior to single soldering of these IC's. Or can I just place one as needed by hand with out baking? Any info woul
Electronics Forum | Sat Aug 03 07:29:20 EDT 2002 | davef
IPC-PE-740 "Troubleshooting for Printed Board Manufacture and Assembly" has words to the effect of � 1.5---BAKING Laminate materials are baked several times during the manufacture of a printed wiring board. There are four major reasons for
