Electronics Forum | Thu Sep 11 11:47:15 EDT 2008 | jeffcali
Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot air machine. Some places don't have the money to spend on mini micro stencils of all types, and thus spend the money on various sizes of solder balls
Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep
Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co
Electronics Forum | Tue Sep 02 12:49:07 EDT 2008 | markhoch
Out for reballing??? The LGA's that I'm familiar with do not have balls. Pull them off with a BGA rework station. Clean up the part and PCB by carefully removing extraneous solder, paste the PCB, (or the bottomside of the LGA itself) and replace. Ref
Electronics Forum | Wed Feb 06 07:18:47 EST 2019 | SMTA-Bob
I am looking for some old scrape boards that have either CCGA or CBGA, high temp columns or balled devices for some process experiments I am doing. If anyone has some please let me know, the company name or supplier will not be see or used Many than
Electronics Forum | Thu Jun 17 22:10:48 EDT 1999 | Earl Moon
| | | Does anyone know where I can find a list of things to do to when troubleshooting issues during the wave solder process? | | | | | | for example: | | | | | | Solder Bridge | | | 1.verify amount of flux been aplied. | | | 2.verify turbulance on
Electronics Forum | Wed Oct 03 23:59:44 EDT 2018 | gaintstar
Flason SMT problem solving: http://www.flason-smt.com/new/PRINCIPLE-OF-SURFACE-MOUNT-PROCESS-SMT-PROCESS.html http://www.flason-smt.com/new/Printed-Circuit-Board-PCB-Price-Estimator.html http://www.flason-smt.com/new/Printed-Circuit-Board-Solder-res
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
Electronics Forum | Sat Aug 05 09:06:40 EDT 2000 | Dave F
I'm confused ... Land Grid Array (LGA). An alternative to the BGA for device manufacturers is to package their devices without any terminations on the bottom. Although not technically accurate, the easiest way to envision an LGA device is to pictu
Electronics Forum | Wed Apr 13 10:05:58 EDT 2016 | donnie15
I am working on soldering an Large LGA module to a PCB and am having some issues with opens due to variation in the board flatness. I have tried adding more paste but get shorts and excess flux as I get above a 7 mil stencil. I have tried adding sol
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
