Electronics Forum | Fri Apr 01 23:32:39 EST 2005 | ccgooi
Hi, I would like to understand more about dye and pry process for BGA assembly. Can anyone provide me more information about reference about this topic.Thanks.
Electronics Forum | Tue May 23 10:40:25 EDT 2006 | Chunks
Chris is right. You can do a good visual after placement if you have outline marks on your silk screen. That helps a lot. What size BGAs are you talking about. That would determine how critical you want to get with inspection.
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Thu May 01 13:55:57 EDT 2008 | mmjm_1099
We have this issue as well in our house. A customer calls out a lead-free bga and wants to place on a leaded assembly. All we do is send it out and get the BGA reballed with leaded balls.
Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Mon Dec 28 11:21:21 EST 1998 | Brad Kendall
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef
BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr
Electronics Forum | Mon Jun 03 22:16:49 EDT 2002 | alex_kirichenko
Hi Jim! Just an idea.... There are some reflow ovens which use cooling on the bottom side of pcb during reflow for doublesided boards. It prevents solder on the bottom side to melt. You might try cooling your BGA while reflowing parts on opposit s
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