Electronics Forum | Tue Oct 15 15:00:33 EDT 2002 | Steve Walters
Is there any info, guidelines or spec's on how many time you can rework a bga location?
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen
Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note
Electronics Forum | Thu Nov 12 16:22:45 EST 1998 | Mike Cox
Any info on a BGA rework machine in the 10-20K range. Thanks Mike C
Electronics Forum | Thu Apr 22 11:59:36 EDT 2004 | Daniel
What is the best rework equipment on the market for BGA's and the pro and cons of others?
Electronics Forum | Tue Feb 20 10:47:19 EST 2001 | Massimo
Hi everybody, I need to collect some documentation about BGA rework, in particular I wolud like to know if there are some "theoretical" studies about this matter (for example a finite element model of a BGA suitable to be used to simulate BGA reflow)
Electronics Forum | Fri Mar 30 11:05:44 EDT 2007 | realchunks
Hi Chris, A lot of it has to do with your product, t-shooting devices and techs ability. There are ways to determine BGA are at fault. X-Ray is a good way to check for shorts. Insufficients are harder to find. Some people use a dye. They squirt
Electronics Forum | Tue Feb 20 13:37:45 EST 2001 | roland
I used the SMTnet search at the top of the page with the keyword "bga" and dropdown component "library" and came up with 14 references. You can also do a search using "BGA" as keyword and "forum" as the dropdown component to get some insight from "t
Electronics Forum | Tue Mar 20 05:26:32 EDT 2007 | CL
Hi Chrissie, BGA Rework from one CM's view: 10% process problem (printing, reflow, voids, etc) 10% component failure (no other problem found) 80% "The board does not work therefore it must be the BGA" This, of course, is exaggerated. My point bein
Electronics Forum | Tue Mar 09 20:08:08 EST 2004 | davef
Warping BGA are the usual cause of shorts in the corners and are usually caused by the reflow profile. BGA have a natural tendency to warp due to CTE and package thermal mismatch, as you have seen at rework. The PBGA will go from a bowl shape to an