Electronics Forum | Wed May 05 12:00:35 EDT 2010 | jrr3434
Thanks for the info! What's a good type of oven for baking boards in?
Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg
Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde
Electronics Forum | Wed Jan 05 17:53:52 EST 2005 | SuePH
We had a contract in house that included a flex board which required an 18 hour bake at 105 degrees. The other brds got along fine with 2 hours, but the flex board would delaminate until we went to this long bake. I don't know how the engineer came
Electronics Forum | Wed Jan 03 16:52:19 EST 2007 | Pete
What is a foolproof means of eliminating moisture content from Printed Circuits that arrive (bot hpurchased and consigned) in unsealed, non-dessicant packed bags? Als, is there a procedure for basic mass of boards vs. temp/cure times? I need to min
Electronics Forum | Mon Mar 08 07:29:53 EST 2004 | mrmaint
Sounds like you have some delamination problems. How hot is the board getting? Try baking the board prior to rework. Is the quality of the board good? Goog Luck. MrMaint
Electronics Forum | Fri Jan 07 07:36:14 EST 2005 | dansmall
I have a Polyimide board that is showing signs of de-lamination. I was wondering what pre-bake times and temperatures other people would recomend for new boards as well for boards that have been on the shelf for 8 months.
Electronics Forum | Wed Jun 19 08:51:49 EDT 2002 | davef
Try this: * Remove PTH components that cannot resist baking like, plastic sockets & electrolytic capacitors. [NOTE: It may be econonomic to sacrifice some of the PTH components that cannot resist baking.] * Bake the board. * Remove, reball, and repla
Electronics Forum | Tue Aug 16 14:01:44 EDT 2011 | emeto
HI, I believe that the problem is moisture in the boards. You should bake the boards in oven for 24hours or so and then run them.
Electronics Forum | Wed Feb 21 21:01:57 EST 2007 | davef
Yes. Heat reduces OSP solderability protection thickness. For instance, many OSP are shot at the end of the first reflow pass and the exposed copper is free to oxidize. If you're speedy, you can pull-off the second reflow cycle before the copper g
Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc
Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a
