Electronics Forum | Wed Jan 02 09:24:00 EST 2013 | swag
Thanks for the help. Ramp soak spike but due to the density of this assembly it's more like ramp spike. Yes, leaded. I'm getting similar results with or without the carrier. (I designed the carrier like swiss cheese, full of holes and scallops on
Electronics Forum | Fri May 15 10:36:08 EDT 1998 | Justin Medernach
| List, | Is there any special disposal protocol needed when the | filters on the PC board washer becomes clogged? How | often do these filters become clogged? These filters | would trap lead and such so how much does it cost to | get rid of the f
Electronics Forum | Thu Apr 28 14:07:24 EDT 2005 | bschreiber
Hello Paul, Prior to 1980, I would say that your concerns were real regarding the resonant frequency. However, since then all major ultrasonic cleaner manufacturers use a "sweep" frequency technology. By "sweeping" or alternating the frequency bet
Electronics Forum | Mon Oct 26 16:01:33 EST 1998 | tom Gervascio
| | I need some info on how to stop the bridges I'm having on | | radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot
Electronics Forum | Mon Apr 02 20:47:22 EDT 2001 | davef
Cuppla questions for ya ... Where are the shorts [above the mask or between the mask and the laminate]? On the board, what material is between the copper traces and the mask? What type of solder mask(s) used by your suppliers? What are they using
Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert
Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom
Electronics Forum | Tue Jul 22 09:05:14 EDT 2003 | davef
Any-Layer Interstitial [Inner] Via Hole (ALIVH). In printed circuit board fabrication, a registered mark of Matsushita Electric for a filled microvia structure in all layers for applications requiring small-size, lightweight build-up PWB to achieve
Electronics Forum | Mon Jun 13 10:28:29 EDT 2005 | andymackie
I've had a lot of experience with solder spatter. It's usually related to moisture (humidity) uptake by the paste, or outgassing from plating: particularly Au/Ni. Solder spatter from the plating will change from board-vendor to board-vendor. I shoul
Electronics Forum | Wed Mar 13 13:08:31 EDT 2024 | lambert
Section 8 in the J-STD-001 was the initial place to start with cleaning and the requirements, however with all the changes going on within the industry with increase product densities and such, a revision is being created to help understand the need
Electronics Forum | Wed Jun 13 16:58:26 EDT 2001 | Ken Lester
Greg; The universal profile concept maybe misleading. the main objective of a reflow system is to reach a certain temperature and maintain it for the required period of time. If your initial profile is set to accomodate this on any board the only va