Electronics Forum | Wed Jul 02 19:20:43 EDT 2003 | teamcanada
Have you looked into Kapton tape as a protectant?
Electronics Forum | Mon Oct 06 09:51:13 EDT 2003 | davef
We ban silicone from our shop. It makes connections unsolderable.
Electronics Forum | Wed Feb 09 16:43:51 EST 2005 | George
Thank you Dave.. Your the best. How you know this stuff is beyond me.
Electronics Forum | Wed Sep 07 17:14:11 EDT 2005 | GS
finest pitch requires ball bonding (gold) GS
Electronics Forum | Tue Dec 27 14:51:49 EST 2005 | davef
What's the issue and situation?
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Sat Jan 06 08:29:08 EST 2007 | davef
There may be a coating on the components that fell-off that prevents the glue from bonding well to those components.
Electronics Forum | Fri Jul 17 21:54:18 EDT 2020 | davef
That is unusual. Is it a once-off or SOP for that part?
Electronics Forum | Tue Jul 18 16:49:49 EDT 2023 | mahasg
Hello All, I am PhD student at polytechnique Montreal. We have a CQFP44 packages and Dies of 51um pad pitch (22nm FDSOI tech) that I need to bond myself at the university using ASM Eagle Xtreme gold wire bonder in the university. we need to perform b
Electronics Forum | Mon Jun 18 16:48:00 EDT 2001 | Gil Zweig
We have found a significant number of PBGA problems associated with physical deformation of the package. Deformations such as dishing (potatoe chipping) and delamination under the die (popcorning). These can be detected by x-ray by the variation patt
