Electronics Forum | Fri May 07 02:37:31 EDT 1999 | Bob Willis
| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad
Electronics Forum | Tue Apr 01 17:14:11 EDT 2008 | aj
Hi, We only have 2 lines , but I dont allow any of the Ops to set them up, I did once and winded up with 10 damaged nozzles and cracked caps on the boards ... If the problem is as big as you say it is , you should really spend some time setting it
Electronics Forum | Tue Oct 05 16:02:04 EDT 2004 | Bryce
I am curious if anyone can help explain to me the cause of an effect we are seeing with some failed caps. The parts have been found to be cracked and in most cases are hard failures (capacitance well out of spec and DCR less than 100 ohm or shorted)
Electronics Forum | Tue Nov 07 22:41:48 EST 2006 | davef
You are correct that hand soldering ceramic capacitors often causes them to crack. They do not take thermal shock well. You might be able to reduce the amount of cracking by following the rework repair guidelines discussed in the fine SMTnet Archiv
Electronics Forum | Fri May 31 12:28:45 EDT 2019 | slthomas
You really need to define what you mean when you say "bend" and when you say "break". You might have zero damage to a bare board but cracked solder joints and ceramic caps on an assembly, given the same amount of bending or stress. It all depends on
Electronics Forum | Thu Jun 17 06:04:48 EDT 1999 | Ron G. Belliard, EET
RE: Cracked Capacitors: I have worked for 3 1/2 yrs with SMTA and have found a similar problem with capacitors. Throughout my studies of the problem, I have discovered three contributing factors that caused this cracking either individually or in co
Electronics Forum | Mon Sep 25 07:35:04 EDT 2000 | Mikel Rodriguez
Hello, We are using FR-2 in boards 15x10cm size, with SMD and thru hole components (about 100 SMD and 50 thru hole). We have some "rare" problems (flex cracks or caps, diodes, and so on). Would we improve something by using CEM-1 instead of FR-2?? Mo
Electronics Forum | Mon Aug 28 18:57:41 EDT 2000 | Earl Moon
Steve, This is a good, well repeated, not identified by IPC yet issue. I, and some others in industry, for years have proven and recommended smaller pads for various devices. I, and some others in industry, use 0402 pads for 0603 device types. IPC o
Electronics Forum | Tue Jun 17 01:27:25 EDT 2003 | Dreamsniper
Hi Guys, I need your opinion here. Has anyone tried doing this Process: Bottomside Process first which means gluing the chip components then reflowing the Glue instead of Curing them, then Topside process which is solder paste printing then compone
Electronics Forum | Fri Sep 25 00:54:39 EDT 1998 | Charles Sullivan
Does anyone have process experience with SMT Panasonic Film Caps or SMT Film Caps from others? What advice can you give on special process precautions.....or special handling? Today we found cracking between the body and terminations after reflow..
